Chroma 3160 C (Handler)
FT Handler – Production temperature from -55°C to +150°C
Applications
High-throughput production with advanced thermal control
The Chroma 3160-C is an automatic Tri-Temp handler developed for high-productivity semiconductor test environments. Designed to support the most demanding ATE platforms, it combines handling speed, thermal stability, and operational reliability to meet the constraints of final test in mass production.
Its exclusive Nitro-TEC™ technology combines liquid nitrogen (LN₂) cooling, TEC thermoelectric modules, and Active Thermal Control (ATC) regulation to ensure precise temperature control throughout the entire test cycle. This architecture allows for rapid switching between hot and cold tests while optimizing liquid nitrogen consumption.
Unlike conventional thermal handlers, the 3160-C adopts a chamberless design that simplifies maintenance operations, improves sub-assembly accessibility, and reduces production changeover times. Compatible with a wide variety of packages such as BGA, QFN, QFP, CSP, Flip-Chip, and TSOP, it is a particularly suitable solution for the automotive, industrial, telecom, and consumer electronics sectors.
Spécifications
Performance designed for demanding production lines
The Chroma 3160-C was developed to maximize test resource utilization while ensuring stable and reproducible thermal results.
Key technical points:
- Advanced thermal technology (Nitro TEC)
- Standard thermal range: -40°C to +125°C
- Available thermal extension: -55°C to +150°C
- Thermal accuracy: ±3°C at the test head
- Component format: 3 x 3 mm to 50 x 50 mm
- Handling technology: Pick & Place with direct contact
- Thermal pre-conditioning zone accuracy: ±5°C
- Index time: 0.6 seconds
- Productivity: up to 3,200 components/hour
- Interfaces: TTL, GPIB, and TCP/IP
- Contact force: 120 kgf
- Reduced downtime during handler maintenance or kit replacement
- Possible site configurations:
- Single site (option)
- Dual sites: 1 x 2 (80 mm)
- Quad sites: 1 x 4 (40 mm); 2 x 2 (80 x 60 mm)
- Octal sites: 2 x 4 (40 x 60 mm)
The integration of a thermal pre-soak zone ensures optimal temperature homogeneity before contact with the test system, thereby reducing measurement deviations and improving result repeatability.
Démonstration / location
A scalable platform designed for industrial performance
The 3160-C can be configured for various productivity levels to adapt to evolving manufacturing needs:
Multi-site configurations
The system is available in the following versions:
Single Site / Dual Sites / Quad Sites / Octal Sites
This modularity allows for gradual increases in test capacity without compromising existing infrastructure.
Reduced downtime
Complete kit changeover can be performed in just 15 minutes, limiting line stoppages during reference changes and improving production flexibility.
Optimized sorting management
The handler features 7 binning categories, allowing for fast and secure separation of components based on their test status.
High-reliability handling
- Automatic component rotation up to ±90° or ±180°
- Extremely low jam rate (1 component per 5,000)
- Automatic tray loading
- Continuous thermal control during handling and test phases
Advanced thermal technology
The use of Nitro-TEC™ technology combined with a non-conductive thermal fluid helps improve test stability while reducing maintenance needs and energy consumption.
The Chroma 3160-C thus represents a particularly suitable solution for semiconductor manufacturers seeking a production thermal handler capable of combining high throughput, precise thermal control, and maximum equipment availability.