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The ONTOS Clean is a semi-automated surface preparation system using patented atmospheric plasma. This unique system allows the use of oxidizing or reducing chemistries without modification. ONTOS Clean performs cleaning, eliminates organic contamination, activates surfaces and eliminates oxidation. An innovative process applies gas passivation which delays the re-oxidation of metal surfaces.
The + of the ONTOS CLEAN:
Patented atmospheric plasma technology: Unlike traditional systems requiring vacuum chambers, the ONTOS Clean uses atmospheric plasma, simplifying the process and reducing costs.
Chemical versatility: Use of helium or argon as carrier gas with the possibility of introducing oxygen (cleaning and activation), hydrogen (oxide removal) or nitrogen (cleaning and passivation).
Non-toxic and dry process: ONTOS Clean provides fast, non-toxic and dry surface preparation, ideal for sensitive environments.
Innovative gas passivation: This unique process delays the re-oxidation of metal surfaces, thus extending the life of the treated components.
The benefits:
Increased efficiency: The system allows for rapid cleaning and activation of surfaces, improving throughput and productivity.
Safety and simplicity: The process is safe for devices and personnel, with no arc discharges, ions, bombardment, redeposition, or flaked particles.
Automation compatibility: The ONTOS Clean is designed to integrate easily into automated production lines, providing a flexible and scalable solution.
Cost reduction: By eliminating the need for vacuum chambers and using non-toxic gases, the ONTOS Clean reduces operational and maintenance costs.
Applications:
- Initial wafer cleaning
- Photoresist descum and activation
- Photoresist activation for via wetting
- Pre-plating preparation
- Removal of various organic materials (polyimide on glass wafer, implanted photoresist on processed or bare silicon wafer, amorphous carbon on silicon wafer)
- General aqueous processes
- Dielectric wet etching
- Metal stripping
- Passivation of delicate surfaces
- Photomask cleaning
- Metal-to-metal bonding (Au-Au, In-In, In-metal pad, In-Ag, SnAg-Cu, SAC-Cu, SAC-SAC)
- Direct bonding (semiconductor-to-semiconductor, oxide-to-oxide, oxide-to-nitride, oxide-to-semiconductor)
- Surface activation for deposition, capillary underfill, die attach, and medical assemblies.
Specifications
The ONTOS Clean is designed to provide fast, non-toxic, and dry surface preparation.
Here are its main technical specifications:
Atmospheric Plasma System:
Unique design with standard treatment zones of 25 mm, 40 mm, or 105 mm wide.
13.56 MHz RF Generator: Wide-range automatic matching network, system safety monitoring, and computer control of forward and reflected power.
Digital Mass Flow Controllers: Precise control of gas flow to the plasma source.
ESD-Safe Enclosure: Interlocked with process gas exhaust (no scrubber required).
Semi-Automatic System: Touchscreen computer-controlled with user-configurable recipe libraries.
Substrate Positioning: Computer-controlled X-Y-Z stage with standard vacuum chuck for 2 to 300 mm wafers and substrate thicknesses up to 20 mm (30 mm without lift pins).
Safety and Efficiency: Simple process without vacuum chamber, fast, ultra-clean, safe for devices and personnel, with no arc discharges, ions, bombardment, redeposition, or flaked particles. OSHA and EPA compliant, CE12 marked.
Options
ONTOS Clean offers several options and benefits to meet specific customer needs:
Chemistry Options: Use of helium or argon as carrier gas with the possibility of introducing oxygen (cleaning and activation), hydrogen (oxide removal) or nitrogen (cleaning and passivation).
Plasma Configurations: Standard 25mm, 40mm and 105mm plasma head. Optional oxygen plasma configuration available upon request.
Easy integration: Compatible with automation, compact configuration, and possibility of integration into customer equipment with a dedicated software module.
The ONTOS Clean is ideal for the semiconductor, automotive, aerospace, medical and optical industries, providing an advanced and reliable surface treatment solution
Pre/post treatment analysis: In-situ ellipsometry, in-situ goniometry, heated chuck, nitrogen environment, oxygen cleaning
