The AWC-650 automatic cleaning system stands out for its exceptional wafer cleaning capabilities after cutting.
This robust and adaptable system removes submicron particles from sawn and grooved substrates, ensuring highly effective and versatile cleaning.
Users can easily adjust and store processes, creating a complete library of recipes in system memory.
With a great level of customization, the AWC-650 allows you to fine-tune the cleaning process to the specific requirements of your job, whether delicate precision cleaning or heavy-duty industrial applications. This adaptability makes the AWC-650 a valuable asset in any cleaning environment.
The AWC-650 is a highly customizable cleaning system that can be tailored to achieve optimal results for any application.
- Standard Atomizer Cleaning Head: This versatile component provides a reliable and efficient cleaning method as the default configuration.
- A high pressure D.I. water nozzle can replace the standard sprayer or be used in conjunction, giving you great versatility during your cleaning operations.
- Custom Chuck: Specially designed to meet the unique requirements of your application, ensuring a perfect fit and optimal cleaning.
- To prevent static electricity buildup on the surface, a CO2 bubbler can be used.
- Substrate sizes : up to 8" mounted on frames.
- Water inlet pressure : Between 5 and 7 bars
- Maximum water consumption : Up to 1.8 liters/minute
- Minimum drainage flow : More than 3 liters/minute
- Maximum nitrogen consumption : 70 NL/minute
- Pression d'air maximale (CDA) : 0.5 to 0.7 MPa (5 to 7 kg/cm²)