distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

CVD/PE CVD

CVD/PE CVD

Parcourir les produits de la gamme


CVD (Chemical Vapor Deposition) is a process used to produce high-performance, high-purity solid materials. The substrate is exposed to one or more gas-phase precursors, which react and/or decompose on the substrate surface to generate the desired deposit. Frequently, reaction by-products, themselves in the gas phase, are produced and evacuated by the gas flow that continuously passes through the reaction chamber.
CVD is widely used to deposit materials in various forms: monocrystalline, polycrystalline, amorphous, epitaxial. These materials include silicon, silica, silicon germanium, silicon carbides, diamond carbon, fibers, nanofibers, filaments, carbon nanotubes, tungsten, high electrical permittivity materials, etc.

Thermal chemical vapor deposition (CVD) uses high temperatures to deposit thin films by reacting gases with a substrate, ideal for materials like silicon and graphene.
Metal-organic CVD (MOCVD) creates high-purity films using metal-organic gases under moderate pressure.
Plasma-enhanced CVD (PECVD) uses plasma to deposit films at lower temperatures, while inductively coupled plasma CVD (ICP-CVD) allows deposition at even lower temperatures, suitable for sensitive substrates such as polymers.

Our partner Elettrorava has been designing and manufacturing thin film deposition machines in Italy for over 35 years.
The equipment offered is flexible for R&D and production, and for multiple applications: optics, semiconductors, medical, photovoltaics, precision watchmaking, etc.

LPCVD, MOCVD, PECVD, ICPCVD

  • Base pressure HV: < 1x10-6 mbar
  • Base pressure UHV: < 1x10-8 mbar
  • Pumping system :
    • Dry primary pump,
    • High vacuum turbomolecular pump
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  • Sources :
    • LPCVD : Resistive or infrared
    • MOCVD : Heating power supply
    • PECVD : DC, pulsed DC, RF, microwave
    • ICPCVD : RF, micro -waves
  • Additional sources :
    • Optional plasma generator,
    • Generator of plasma
  • Deposition area :Up to 12”
  • Substrate handling :
    • Multi-wafer support
    • Rotation: up to 50 rpm
  • Process temperature: Up to 1000°C
  • Reactive process:One or more reactive gases (O2, H2, CH4, SiH4, etc.) and liquid precursors
  • Thickness uniformity : Up to 3%
  • Process control :
    • LPCVD : Pyrometer or thermocouple for control of the temperature
    • MOCVD: Optional optical monitor depending on the type of deposited material
    • PECVD and ICPCVD: Control of the multilayer recipe, optionally plasma control or ellipsometry.
  • Substrate load:Manual in the main chamber or by load lock with manual or automatic manipulator</li >
  • Load lock :Single or multiple loading locks, manual or motorized with multiple substrate holders
  • Multi wafer loading :Optional system of multi-wafer cassettes up to 25 wafers
  • Deposited materials:Metals, oxides, nitrides, carbides, semiconductors, carbon-based materials, organic materials
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• Single or multi-chamber (cluster)
• Up to 12 gas lines
• Solid, liquid or gaseous precursors
• Custom-made enclosures
• Simple automatic or manual loading or from a 5 or 25 wafer cassette
• Custom-made chuck
• Airlock possible
• Automatic pumping
• Multi-layer possibilities
• Doping possible
• Thickness measuring system (laser interferometer or quartz balance)
• Wafer up to 300 mm (more on request
• Possible substrate temperature from +20° to +1000°C


Connectez-vous à notre expert
Laurent BEDDELEM
laurent.beddelem@microtest-semi.com
06.34.10.75.23

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