OUR EQUIPMENT
FRONT-END
Equipment for semiconductor manufacturing processes: thin-film deposition, wafer cleaning, photolithography, etching, bonding/debonding, baking ovens
ASSEMBLY
Microelectronics wafer and chip assembly equipment: wafer assembly, laser cutting, scriber / breaker, UV irradiators, post-saw cleaning, pick&place (sorting), wire bonding, hot plates.
TEST
Equipment for testing wafers and microelectronic components: probing, optical/photonic testing, temperature testing, burn-in, leak testing, ovens and centrifuges.
CONSUMABLES AND TOOLS
Consumables for all manufacturing processes: tweezers, vacuum pick-up pens and tools, packaging (frames / boxes / cassettes), bonding tools, saw blades, second-source parts (front-end).
Installation / Formation
1
SAV
2
Maintenance préventive et corrective
3
Calibrage, calibrage de la température
4
Equipment rental
5
OUR TEAM
Laurent Beddelem
DIRECTOR
Laurent.beddelem@microtest-semi.com
Mobile : 06 34 10 75 23
Pierre Turin
Technical Sales Manager Southern Region
pierre.turin@microtest-semi.com
Mobile : 06 66 25 34 04
Nicolas Roy
Technical sales manager Eastern region
nicolas.roy@microtest-semi.com
Mobile : 06 59 32 73 52
Maria-Luisa Marini
TECHNICAL SALES MANAGER, NORTHERN REGION
Mobile : 06 84 65 36 57
Patrick Ceas
technical Manager
patrick.ceas@microtest-semi.com
Mobile : 06 61 55 07 18
Stéphane Croisy
Maintenance technician
stephane.croisy@microtest-semi.com
Mobile : 06 48 09 06 75
Sylvie Olivier
Administrative and logistics manager
sylvie.olivier@microtest-semi.com
Fixe : 04 90 40 60 90
Marie-Hélène Beddelem
Project manager
mh.beddelem@microtest-semi.com
Mobile : 07 49 09 77 24
- CONTACT US