distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
The WB200 is a semi-automatic multi-purpose tool designed to perform microwiring for research and development, prototyping and small batch production.
Available in fully manual or semi-automatic version, with adjusted search heights and a fully automated loop, it will allow you to perform ball, bump or wedge bonding with great precision.
In its configuration with a vertical camera, it eliminates any parallax effect and makes its use simple for experienced users and accessible to novices or students.
Its robust and durable design is the result of several decades of development by JFP Microelectronics.
The welding machine offers the following features :
WB100 :
Fully manual, it is the most economical version.
WB200 :
Semi-automatic mode, it allows programmable loops, automatic movement of the XY axes, automatic search for the height in Z and with the camera perfectly aligned with the tool, elimination of the parallax phenomenon, better precision and better comfort .
WB201 :
With its Ball 360 mode, it is the most automated model. It allows you to directly program your wiring, create complex wire patterns and automatically place them on one or more chips at a time.
