French distributor of equipment and consumables for the Semiconductor industry.

Chroma 3260 (Handler)

SLT Handler – Production requiring the highest level of quality

Applications

Advanced functional validation before shipment

Chroma 3260 Automatic System Function Test (ASFT) was developed to provide an additional level of control between traditional electrical testing and delivery of components to end customers. Designed for semiconductor manufacturers requiring the highest level of quality, it verifies the real behavior of integrated circuits under conditions close to their end use.

Positioned after package test and electrical qualification steps, the 3260 performs automated functional tests capable of revealing certain failures that may go unnoticed during conventional checks. This approach helps reduce field failure risk, lower customer reject rates, and improve quality indicators such as DPPM.

Thanks to its fully automated architecture, the system eliminates constraints associated with manual operations, improves test repeatability, and ensures consistent quality throughout production runs. It is therefore a particularly relevant solution for manufacturers of components intended for automotive, industrial, telecom, and high-reliability electronics markets.

Spécifications

A platform designed for high-performance functional testing

Chroma 3260 combines automation, flexibility, and multi-site capability to meet the needs of modern production lines.

Key features:

  • Reliable, high-speed pick-and-place handler
  • Automatic learning of contact force
  • Compatible with Gull Wing packages
  • No damage to carriers
  • Pneumatic damper for contact balancing
  • Protection of integrated circuits in carriers
  • Simultaneous testing of up to 6 components
  • Compatible packages: BGA / CSP / QFP / PGA / Flip-Chip / TSOP
  • Component dimensions: 4 × 4 mm to 45 × 45 mm
  • Ball/pin pitch from 0.4 mm
  • Index time of approximately 3 seconds
  • Test cycle close to 3.5 seconds per site
  • Standard RS-232 interfaces
  • USB, GPIB, and TTL options available
  • Robust industrial architecture designed for continuous operation

Its robotic system ensures precise component positioning, reducing the risk of misinsertion and contributing to stable test results over long production runs.

Démonstration / location

Features designed to improve product quality

More than just a handler, the Chroma 3260 is a complete automated quality control platform.

Reproducing real-world operating conditions
To evaluate components under conditions representative of their final environment, various thermal control technologies can be integrated:

  • TriTemp Control
  • Active Thermal Control (ATC)
  • Unity PTC
  • Cooling Pipe

These solutions enable testing at ambient, low, or high temperature depending on product requirements.

Configurable thermal control
Depending on the selected configuration, tests can be performed over a temperature range up to -55°C to +135°C, with excellent control stability to ensure measurement repeatability.

Advanced production automation
The system integrates numerous features designed to reduce operator intervention:

  • Automatic loading and unloading
  • Dual tray management (Dual Tray)
  • Automatic re-test of failing components
  • Production yield monitoring (Yield Monitoring)
  • Automated presence and orientation check of components

Process inspection and safeguarding
A CCD camera can be used to verify component orientation before insertion and limit the risk of handling-related defects. Continuous monitoring of socket condition also helps maintain a high level of quality and repeatability.

Adaptation for the most demanding applications
Several options can complement the configuration:

  • RF shielding for sensitive applications
  • Extended communication interfaces
  • Specific thermal modules
  • Enhanced cooling solutions
  • Customization of handling systems

Chroma 3260 ASFT is therefore a particularly suitable solution for manufacturers looking to strengthen their quality control strategies by adding an automated functional validation step capable of detecting the most difficult-to-identify defects before components are released to market.

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