Laser systems

AUREL ALS200

• Double laser head (cutting nozzle and marking nozzle)
• For substrates Si, SiC, GaN, GaAs, InP, GaP, Al2O3, AlN, glass, CdTe, metals and polymers
• Substrate up to 150 mm (more on request)
• Auto loading (possible in cassette) or manual
• Source laser CO2
• Laser RF generator 350-1000 W
• Custom Chuck
• Motorized Z focus
• Camera alignment system (pattern recognition option)
• Particle and smoke filtration system (suction under and behind the chuck)