Laser systems
Marking - Drilling - Laser cutting
Presentation
AUREL ALS200
- Double laser head (cutting nozzle and marking nozzle)
- For substrates Si, SiC, GaN, GaAs, InP, GaP, Al2O3, AlN, glass, CdTe, metals and polymers
- Substrate up to 150 mm (more on request)
- Auto loading (possible in cassette) or manual
- Source laser CO2
- Laser RF generator 350-1000 W
- Custom Chuck
- Motorized Z focus
- Camera alignment system (pattern recognition option)
- Particle and smoke filtration system (suction under and behind the chuck)
