Laser Systems
Marking - Drilling - Laser cutting
Presentation
AUREL ALS200
- Double laser head (cutting nozzle and marking nozzle)
- For Si, SiC, GaN, GaAs, InP, GaP, Al2O3, AlN, glass, CdTe, metal and polymer substrates
- Substrate up to 150 mm (more on request)
- Auto loading (possible with cassette) or manual loading
- CO2 laser source
- 350-1000 W RF laser generator
- Custom-made Chuck
- Motorized Z-focus
- Camera alignment system (pattern recognition option)
- Particle and fume filtration system (suction under and behind the chuck)
