Bond testing tools

• The Die shear is a test for checking the bonding strength by shearing by applying a thrust between the chip and the substrate.

• The Ball shear consists of shearing the solder balls or wire links.

• For each tool, please provide us with the face and width dimensions of the tool, as well as the total length and diameter (see catalog)

Custom manufacturing:

Please provide us with the brand and model of the equipment used as well as the dimensions and diagrams corresponding to your chips so that our design teams can make a proposal to validate.