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Clusters

multifunction lithography

Browse the products in the range

Robotechnik's MAXIMUS series includes high-performance microcluster systems designed for automated substrate production processes in the semiconductor industry. These systems are ideal for achieving excellent process results, uniformity, and repeatability. The MAXIMUS series includes models such as the MAXIMUS 804 and MAXIMUS 806, each tailored to specific needs and applications.

The MAXIMUS 804 is a fully automated microcluster system designed for single substrate production processes. It handles wafer sizes from Ø 2” to Ø 8” and substrate sizes from 2”x2” to 6”x6”. The system can be equipped with up to 4 process units such as coater, developer, cleaner, etcher, heating plates, cooling plates and HMDS plates. The MAXIMUS 806 offers similar capabilities but can be equipped with up to 6 process units, making it suitable for larger applications.

Technical Advantages :

  • Uniformity and Repeatability: Patented Covered Chuck technology ensures excellent coating uniformity.
  • Versatility: Capable of handling various processes including coating, developing, cleaning, etching and baking.
  • Ease of Use: Features such as touchscreens, programmable speed and acceleration, and easy chuck changes improve user experience and maintenance.
  • Automation: These fully automated and flexible systems improve the efficiency and repeatability of lithography processes.

Applications :

These microcluster systems are widely used in the semiconductor industry for processes such as photoresist coating, development, cleaning, etching, and baking. They are essential tools for achieving high-quality, uniform processing on various substrates, ensuring optimal performance in subsequent manufacturing steps.

Power supply: three-phase current 400 V / 50 Hz / 32 A
User interface with touch screen.
Robotic arm for fully automatic processes.
Loading by cassettes.
Programmable speed and acceleration.
Easy replacement of chucks for different substrate sizes.
Easily replaceable process bowls.
Up to 1000 programmed recipes.
Interface Ethernet.

MAXIMUS 804 :

  • Wafer size: up to Ø 8” (200 mm) or substrate size up to 6” x 6” (150 x 150 mm)
  • Rotation speed: up to 6,000 ± 1 rpm
  • Dimensions : 2400 mm x 1800 mm x 2100 mm
  • Up to 4 process units

MAXIMUS 806 :

  • Wafer size: up to Ø 8” (200 mm) or substrate size up to 6” x 6” (150 x 150 mm)
  • Rotation speed: up to 6,000 ± 1 rpm
  • Dimensions : 2400 mm x 1800 mm x 2100 mm
  • Up to 6 process units

MAXIMUS 1203 :

  • Wafer size: up to Ø 12” (300 mm) or substrate size up to 225 x 225 mm)
  • Rotation speed: up to 6,000 ± 1 rpm
  • Dimensions : 1700 mm x 1000 mm x 2200 mm
  • Up to 3 process units

MAXIMUS 6003 :

  • Wafer size: up to 750 mm
  • Rotation speed: up to 6,000 ± 1 rpm
  • Up to 3 process units

The MAXIMUS series offers a wide range of options to improve functionality and automation :

  • Electronic media arm: Programmable in position and speed.
  • Multiple process units: Coater, developer, cleaner, etcher, heating plates, cooling plates, HMDS plates.
  • Dispensing Nozzles: Spray, full stream (puddle) for various media.
  • EBD Edge Elimination System.
  • Rear rinse.
  • Heated media lines: Up to 80°C.
  • Megasonic nozzle.
  • Chucks: Various sizes, vacuum or low contact.
  • Disposable process bowls: With anti-splash rings.
  • Vacuum pump.
  • Heating plate: standard or for HMDS process

Connect with our expert
Laurent BEDDELEM
laurent.beddelem@microtest-semi.com
06.34.10.75.23

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