Ovens and ovens for bumping, balling, LED assembly, SMT annealing, preforms and pin-in-paste processes.
- Front or top opening (safety lock to prevent opening during the process)
- Resistive or radiant heating (infrared lamps) up to 650°C
- Temperature uniformity
- Ultra-controlled process in perfectly repeatable conditions for an identical result for each process
- Up to 2 gas lines
- Possibility to inject a flow of formic acid during heat treatment (to avoid voids)
- Vacuum up to 10-3 hPa
- Temperature rise rate: 200°C/min max
- Ultra compact systems
- Programming touch screen
- Wafer up to 200 mm