Ohmic trimming of thick layers and resistors and functional trimming of hybrid, digital, ASIC and RF circuits
- Lasers of your choice :
- 1064 nm – Diode (6-12 W)
- 532 nm – Diode (3-6 W)
- 355 nm – Diode (1-3 W)
- +1064 nm – Lampe (50W)
- Also allows marking
- Substrate up to 200 mm x 300 mm (more on request)
- Auto loading (possible in cassette) or manual
- Laser positioning via galvanometric system (resolution 1.7 µm)
- Measuring device for target value, tolerance, acceptance and ratio
- Different types of trimming cutout (L or double)
- Camera alignment system (pattern recognition option)
- Particle and smoke filtration system (suction under and behind the chuck)
- Compatible with probe cards and micropositioners+tips (flying probes) and possible combination of flying probes and probe cards
