KLOE’s Dilase range includes the Dilase 125, 250, 650 and 750 models, each offering advanced solutions for various applications.
Dilase equipment is designed to provide a direct laser writing without mask, guaranteeing exceptional flexibility and precisionto meet the needs of high-tech industries. They enable fast and precise writing, without the constraints of traditional photolithography methods.
The Dilase range of equipment benefits from KLOE's expertise in optical design, offering unmatched performance in the field of photolithography :
- Precision and flexibility: Dilase systems offer a resolution of up to 0.5µm, allowing complex patterns to be produced with high precision.
- Maskless Technology: Direct laser writing eliminates the need for masks, reducing costs and production times.
- Versatility: Suitable for a wide range of applications, Dilase equipment can process various types of substrates and resins.
- Reliability and performance: Dilase systems are designed for intensive use, with a laser diode life of over 10,000 hours.
Applications :
- Microfluidics : Fabrication of microfluidic devices with high precision.
- Microelectronics : Production of integrated circuits and electronic components.
- Micromechanics : Creation of mechanical structures on a microscopic scale.
- Surface functionalization : Modifying surfaces for specific properties.
- Photonics : Fabrication of optical devices such as microlenses and diffraction gratings.
With the Dilase range, you benefit from cutting-edge equipment, offering high performance and an extraordinary user experience for equipment designed and manufactured in France.
Dilse 125 :
- Resolution: 5µm standard, up to 3µm.
- Linear writing speed: > 100mm/s.
- Accepted file formats: LWI, DXF, GDSII.
- Source laser : 405nm (50mW), option 375nm (70mW).
- Sample size: From 3x3mm² to 4", up to 5" for square substrates.
Dilse 250 :
- Resolution: 1µm to 50µm.
- Linear writing speed: > 100mm/s.
- Accepted file formats: LWI, DXF, GDSII.
- Source laser : 375nm ou 405nm.
- Sample size: From 3x3mm² to 4", up to 5" for square substrates.
Dilse 650 :
- Resolution: 1µm to 50µm, 0.5µm option.
- Linear writing speed: > 500mm/s.
- Accepted file formats: LWI, DXF, GDSII.
- Source laser : 375nm ou 405nm.
- Sample size: From 3x3mm² to 4", up to 6" for square substrates.
Dilse 750 :
- Resolution: 0.5µm to 50µm.
- Linear writing speed: > 350mm/s.
- Accepted file formats: LWI, DXF, GDSII.
- Source laser : 325nm, 375nm ou 405nm.
- Sample size: From 3x3mm² to 4", 6", 8" or 12".
(contact us for the technical sheet of Dilase 750)
Options available for the Dilase range :
- Filters to reduce power density: Available for Dilase 125 models.
- Video Realignment System: Option for increased accuracy and multi-layer alignment.
- Laser beam width: Options from 0.5µm to 50µm depending on the model.
- Laser Sources: 325nm, 375nm and 405nm wavelength options.
- Integrated software: KloeDesign, DFL Creator, DilaseSoft for design and writing.
- Samples Accepted: Various sizes and thicknesses of compatible substrates.
KLOE's Dilase line of equipment offers customizable solutions to meet specific customer needs in microelectronics, microfluidics, micromechanics, photolithography and more.
