MICRO
TEST
French distributor of equipment and consumables for the Semiconductor industry.
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Our equipment
Front-End
Deposition of thin layers
Sputtering/Pulverization (PVD)
Evaporation (PVD)
CVD/PE-CVD
High speed models for advanced R&D and production
Compact models
Wafer cleaning
Wafer cleaning
Photo lithographie
Spin coater & spray coater
Hot plates
Clusters
Laser photolithography
LED maskers and mask aligners
Gravure
Plasma etching/Ionic machining
Fours, Ovens
Treatment and annealing furnaces (RTP and VPO)
High-temperature furnaces
Ovens, incubators
Assemblage
Assembling you wafer
Wafer mounting on tape (Wafer Mounter)
Cutting
Semi-automatic Scriber & Breaker (S100)
Manual Scriber
Post sawing cleaning
Automatic Wafer Cleaner
Insolation UV
Manual UV curing (lamps or LEDs)
Auto UV curing (UV-9200/UV-9300)
Sorting and Micro-Wiring
Semi-automatic Pick Place (Die Bonder)
Full-Automatic Pick Place (Die Bonder)
Pick Place Manuel (Die Bonder)
Micro ultrasonic wire bonder
Laser systems
Laser Trimer
Laser marking/drilling/cutting
Screen printing
Screen printer
Fours, Ovens
Static and continuous furnaces
Temperature chambers
Soldering/reflow furnaces (RSO, RSS and VSS)
Test
Test under tips/Prober
Probers Manuals
Semi-automatic Probers
Automatic Probers
Test accessories
Tip cards
Micro test chambers/ Microprobe
Micro tip test chamber
Micro test chamber for LCC chip
Optical microchamber
Vertical electrochemical Raman reactor
Sample holder for scanning microscope
Temperature Test
Cooling unit (chiller, air-conditioning cooler)
Temperature conditioners (Girafe, Thermal Stream)
Temperature chambers
Hot plates
Other Tests
Burn-In (Aging test)
Leak Test
HAST test
Optical Test
Chip sorters (Automatic Die Sorter)
Test solutions for photonics (Photonics Automation Probers)
Optical inspection: AOI systems
Consumables and Tools
Packaging
Film frames – Cadres pour wafers
Individual boxes for wafers on frames or rings
Magazines for wafers on frames or rings
Grip Rings (GRP) – Plastic rings for wafers
Manipulation
Wafer grippers
Tweezers
Cutting and folding pliers
Handling when empty
Taken by vacuum – wafers
Vacuum pick-up – components and small parts
Vacuum grip consumables: suction cups
Die bonding – Bonding test
Bonding tools: holders
Picking tools
Bond testing tools
Detached parts
Spare parts
Our services
Installation/formation
SAV
Preventive and corrective maintenance
Calibration, temperature calibration
Equipment rental
Our partners
Front-end equipment
Assembly Equipment
Test Equipment
Consumables
About us
Our team
Our history
Our enterprise
Our partners
Localisation
Environnement
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English
French
Optical inspection: AOI systems
Desktop Inspection Machine
Roll to Roll optical inspection machine
Inspection of surface defects on wafers
TTV Warp and Thickness Measuring Machine
Wafer surface particle inspection machine
IC support tape inspection
Automatic multi-zone AOI visual inspection machine
AOI (Automated Optical Inspection)
