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TTV Warp and Thickness Measuring Machine

Solution de mesure TTV (Total Thickness Variation)
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Designed to meet the stringent quality control requirements in the semiconductor industry, Chernger's TTV (Total Thickness Variation) gauge provides fast and accurate measurement of the thickness, warp and profile of 12-inch wafers.

Thanks to its advanced multipoint measurement technology, this solution stands out as an essential tool for applications requiring reliable metrological characterization of transparent substrates, such as glass, sapphire or silicon wafers.

This equipment is perfectly suited to ISO 6 or higher production environments, where control of thickness variations and mechanical deformations is essential to the performance of advanced assembly and packaging processes.

  • Substrate Compatibility: Transparent wafers up to 12 inches
  • Measurement of TTV / Thickness / Warp / Arc from 17 fixed points distributed across the surface
  • Single Point Repeatability: ≤ 2 µm
  • Cycle Time: ≤ 60 seconds per wafer
  • Complete Graphical Results:
    • Height Color Map (3D Profile)
    • TTV, Warp, and Arc Data
    • Directional Profile Diagrams (X/Y)
  • Advanced Statistical Analysis for more 3000 measurement points
  • Real-time display of values ​​with automatic export
  • Three configurable scanning modes:
    • High precision (1 sec/point)
    • Speed/precision balance (50 ms/point)
    • High speed (continuous moving scan)

The TTV gauge excels in its versatility for integration, whether in the laboratory, on the production line, or in a cleanroom environment.

It enables:

  • precise quality control of substrates before or after critical steps such as polishing, etching, or thin-film deposition
  • complete traceability of deformation data, essential for statistical process control (SPC)
  • reduction of scrap through the detection of dimensional anomalies before encapsulation or assembly
  • easy integration into MES systems thanks to its standardized data export
Connect with our expert
Laurent BEDDELEM
laurent.beddelem@microtest-semi.com
06.34.10.75.23

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