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Inspection of surface defects on wafers

Advanced optical inspection for 6", 8", 12" wafers
Browse the products in the range

Designed for precision metrological inspection in the semiconductor industry, the wafer surface defect inspection machine enables automated high-resolution detection on 6", 8" and 12" wafers.

Thanks to a 12 MP industrial camera and motorized multi-zoom optics (5X to 100X), this solution is ideal for detailed analysis of post-manufacturing defects or final quality control.

It is perfectly suited for post-dicing, post-trimming or backend material entry inspection stages, with the ability to spot defects as small as 0.035 µm², including cracks, scratches, contamination or delamination.

Equipped with an intelligent interface and compatibility with MES (Manufacturing Execution System) systems, this machine integrates perfectly into automated or semi-automated production lines.

  • Wafer Compatibility: 6", 8", 12"
  • Camera: 12 MP (4000 x 3000)
  • Motorized Objectives: 5X / 10X / 20X / 50X / 100X
  • Light Source: Internal coaxial LED
  • Minimum Defect Detectable: 0.035 µm²
  • Detection Accuracy: Up to 0.07 µm
  • Loading/Unloading: Manual or via wafer cassette
  • Vibration Control: Stable inspection at magnifications up to 50X
  • Automatic report output: text + wafer map (SINF)
  • Visualization of abnormal matrices: SINF image viewable at any time

This inspection machine stands out for its operational modularity and high analytical accuracy:

  • Intelligent Pick & Place mode for automated loading
  • Direct integration with MES for traceability and real-time analysis
  • Automatic defect mapping on wafers for quick review
  • Offline image and data output
  • Fast switching between different wafer formats

Ideal for end-of-line inspection, post-packaging, or incoming quality control.

Connect with our expert
Laurent BEDDELEM
laurent.beddelem@microtest-semi.com
06.34.10.75.23

Merci d'entrer vos coordonnées pour télécharger la fiche technique.

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