Semi-automatic Probers

MPI TS2000 series: Semi-automatic undertip test system up to 200 mm for reliable DC, RF and high-power production test measurements

Designed for a wide variety of wafer production applications

DC-IV/ DC-CV / Pulsed-IV applications
RF applications up to 67 GHz and 4-port configuration
High-power generation applications up to 10 kV / 600 A
Validation of integrated circuit design from ambient to 300°C

Production reliability

Designed for 24/7 production reliability
Integrated passive anti-vibration table
Optional active anti-vibration base
Designed for ambient temperature measurements up to 300°C

Ergonomic design and options

Designed for easy front loading of a single wafer
Large test board supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5″ probe card support.
Available with various chuck options and a wide range of accessories such as 4.5″ probe card adapter, DC / RF micropositioners, high-performance microscopes to support a variety of applications

MPI TS2000-HP: Semi-automatic pin testing system up to 200 mm for accurate, reliable high-power measurements

Designed for high-voltage, high-current applications

High-power device measurement on wafer up to 10 kV / 600A
Gold-plated chuck surface for minimum contact resistance and vacuum holes optimized for handling thin wafers down to 50 μm
Chuck option for Taiko wafer
Dedicated high-voltage, high-current test tips
Anti-arc solutions

MPI ShieldEnvironment for precise measurements

Designed for advanced EMI / RFI / light shielding
Low-leakage fA capacities
Allows temperature testing from -60 °C to 300 °C

Ergonomic design and safety

Advanced single-wafer front and automatic loading capability with easy pre-alignment for automated routines
Regulation-approved light curtain to protect users
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety Test Management (STM™) option for loading / unloading wafers at any chuck temperature and automatic dew point control.

MPI TS2000-IFE: Semi-automatic probe test systems up to 200 mm designed for mmW, Load-pull, SiPH and product engineering.

Designed for a wide variety of wafer applications

Silicon photonics
RF, mmW, load-pull applications and 4-port configuration
Validation of integrated circuit design, failure analysis over a wide temperature range from -60°C to 300°C
Wafer reliability test

Extended flexibility

MPI IceFreeEnvironment™ for simultaneous use of MicroPositioners and probe cards, even at negative temperatures
Programmable microscope movements for greater automation and ease of use

Reduced stage-to-chuck distance for mmW measurements and active tip testing
Compatible with wafers on fram

Ergonomic design and compact footprint

Easy loading of wafers or a single DUT from the front
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety test management (STM™) with automated dew point control
Space-saving thanks to intelligent refrigeration unit layout
Instrument rack option for shorter RF cables offering high measurement dynamics

MPI TS2000-SE : Semi-automatic probe testing system up to 200 mm: For accurate and reliable DC / CV, RF and mmW measurements

Designed for a wide variety of wafer applications

Device modeling – DC-IV / DC-CV / Pulse-IV
Failure analysis – Tip cards / Inter-node testing
Wafer reliability test – Hot/cold/long-term test

MPI ShielDEnvironment for™ precise measurements

Designed for advanced EMI / RFI / light shielding
MoCapacités fA à faible fuite
Allows temperature testing from -60 °C to 300 °C

Ergonomic design and options

Advanced single-wafer front and automatic loading capability with easy pre-alignment for automated routines
Vertical Control Environment (VCE™) with side test area observation for safe operation
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety Test Management (STM™) option for loading/unloading wafers at any chuck temperature and automatic dew point control

MPI TS3000 series: Semi-automatic sub-tip test systems up to 300 mm dedicated to product engineering with IceFreeEnvironment™

Designed for a wide variety of wafer applications

DC-IV / DC-CV / Pulsed-IV applications
RF, mmW, load-pull applications and 4-port configuration
Validation of integrated circuit design, failure analysis over a wide temperature range from -60°C to 300°C
Wafer reliability test – Hot / cold test

Extended flexibility

MPI IceFreeEnvironment™ for simultaneous use of manipulators and a tip card, even at sub-zero temperatures
Programmable microscope movements for greater automation and ease of use
Reduced stage-to-chuck distance for mmW measurements and active tip testing

Compatible with wafers on frame

Ergonomic design and compact footprint

Easy loading of wafers or a single DUT from the front
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety test management (STM™) with automated dew point control
Space-saving thanks to intelligent refrigeration unit layout
Instrument rack option for shorter RF cables offering high measurement dynamics

MPI TS3000-HP: Semi-automatic pin testing system up to 300 mm for accurate and reliable high-power measurements

Designed for high-voltage, high-current applications

High-power device measurement on wafer up to 10 kV / 600A
Gold-plated chuck surface for minimum contact resistance and vacuum holes optimized for handling thin wafers down to 50 μm
Chuck option for Taiko wafer
Dedicated high-voltage, high-current test tips
Anti-arc solutions

MPI ShieldEnvironment for accurate™ measurements

Designed for advanced EMI / RFI / light shielding
Low-leakage fA capacities
Allows temperature testing from -60 °C to 300 °C

Ergonomic design and safety

Easy front loading of wafers or a single DUT
Regulation-approved light curtain to protect users
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety Test Management (STM™) option for loading / unloading wafers at any chuck temperature and automatic dew point control.

MPI TS3000-SE: Semi-automatic sub-tip test system up to 300 mm for accurate and reliable IV, CV, pulsed IV, 1 / f and RF measurements

Designed for a variety of wafer applications

Device modeling – DC-IV, DC-CV, Pulse-IV, ESD, 1/f
RF and mmW – RF configuration from 26 GHz to 110 GHz and beyond
Wafer reliability tests – for precise stress and measurement conditions
Integrated drivers for leading test software

MPI ShielDEnvironment for™ precise measurements

Advanced EMI / RFI / light shielding for improved 1/f noise test results
Very low-noise IV measurements down to fA level
Programmable microscope movements for test automation and ease of use
Wide temperature range -60 °C to 300 °C with unique configuration flexibility

Ergonomic design and options

Easy loading of wafers or a single DUT from the front
Integrated active anti-vibration table
Fully integrated test station control system for faster, safer and more convenient operation
Safety test management (STM™) with automated dew point control
Space-saving thanks to intelligent chiller integration
Instrument rack option for shorter RF cables offering high measurement dynamics

Semi-automatic Probers

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