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Probers TS2000 IFE

TS2000-IFE Automated Test Station

MPI’s most versatile 200 mm platform.

The MPI TS2000-IFE test station is an automated platform that can be converted from the outset or at any later time at the customer site into a fully automatic test station.
It integrates MPI’s advanced technologies, such as PHC™ as standard and mDrive™ or VCE™ as options.
Main applications are load-pull, RF, mmW, silicon photonics (SiPH), design validation (product engineering) or testing of MEMS and other sensors in a defined test environment.

By combining it with the WaferWallet® MAX, MPI provides the transition from the lab to the factory floor for these specific applications.

The THZ-Selection is based on the TS2000-IFE platform, and converts it into a fully automatic test station. dedicated test for RF, mmW, THZ and load-pull measurements, the first on the market that does not compromise the directivity and measurement accuracy in wide temperature ranges from -60°C to +300°C.

Automatic test in:

  • Eliminating the need for additional waveguides in S-band, especially in the sub-THz or THz range,
  • Minimizing the signal path for load-pull applications and offering the widest tuning range and highest Gamma,
  • Simple and convenient operation when switching between frequency bands.

 

The THZ-Selection incorporates MPI's innovative design for frequency extender integration, originally developed for the TS200-THZ, which moves the extender across the entire 200mm wafer.

Large Test Platform
The TS2000 Series features a large, easily accessible test platform that can accommodate up to 12 DC micropositioners or 4 RF micropositioners.
The integration of load-pull tuners or larger area micropositioners makes the TS2000 system an ideal choice for RF and mmW measurements.

IceFreeEnvironment™
Incorporating MPI’s IceFreeEnvironment™, the TS2000-IFE enables testing with MicroPositioners and probe cards simultaneously over a wide temperature range of -60°C to +300°C.
The design shortens the signal path, making the probe station an ideal choice for mmW and/or load-pull.

Integrated Control Panel
The intelligent control panel is fully integrated into the system and has been designed based on decades of experience and customer interactions to provide faster, safer and more convenient prober control and test operations. The keyboard and mouse are strategically placed to control the software if necessary and also control the Windows®-based instrumentation.
The vacuum control panel for the Wafer and AUX chucks is located on the front right side for easy access during the loading/unloading procedure.

Probe Card and Micropositioners – Simultaneously
The low profile probe card holder for 4.5" x 11" probe cards and a shorter distance between the wafer and chuck are ideal for simultaneous testing with active tips, making the system an ideal choice for design validation and/or failure analysis.

Integrated ERS Patented AC3 Cooling Technology
These chucks incorporate ERS Patented AC3 Cooling Technology and its Air Management System to purge the MPI ShielDEnvironment™ directly from "used" air - reducing dry air consumption by up to 30 to 50% compared to other systems on the market.

WaferWallet®MAX - 10x Higher Productivity
MPI’s WaferWallet® MAX is scalable and meets the demand for faster time to market, collecting data from multiple 100, 150 or 200 mm wafers, and increasing testing in a pre-production environment.
With the fastest thermal transition time, reduced soak time, advanced alignment technologies, hot/cold swapping of cassettes or wafers, the WaferWallet® MAX increases system productivity and test cell efficiency up to 10 times.
The Wafer-ID reader is available as an option.

A wide choice of chucks depending on the application
The TS2000-IFE is available with different chuck options to meet different budgets and requirements application:
Ambient chucks: Coaxial, Triaxial or RF with two auxiliary ceramic chucks for precise RF calibration.
Various ERS AirCool thermal chucks from -60°C to 300°C.

Auxiliary chucks for RF calibration
The RF chucks integrate two auxiliary chucks constructed of ceramic for precise RF calibration.

Measurement instrument integration
The optional instrument shelf reduces cable length and increases measurement dynamics and directionality for RF and mmW applications.

Various choices of optics and movements
A wide range of optics is available for all common DC/CV applications or for high magnification digital microscopes for RF or load-pull configurations.

Alignment advanced
Advanced alignment features such as the down-facing off-axis camera and the up-facing chuck-mounted camera make the TS2000-IFE an ideal platform for testing in complex RF, mmW and SiPh measurement setups. Decades of experience from the MPI Photonics Automation division make this option highly reliable.


Connectez-vous à notre expert
Laurent BEDDELEM
laurent.beddelem@microtest-semi.com
06.34.10.75.23

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