MICROTEST

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Automatic Probers

MPI TS2000-IFE: Semi-automatic probe test systems up to 200 mm designed for mmW, Load-pull, SiPH and product engineering.

Designed for a wide variety of wafer applications

  • DC-IV / DC-CV / Pulsed-IV applications
  • Silicon photonics
  • RF, mmW, load-pull applications and 4-port configuration
  • Validation of integrated circuit design, failure analysis over a wide temperature range from -60°C to 300°C
  • Wafer reliability test

 

WaferWalletMax® option

  • Designed for 100, 150 or 200 mm cassettes
  • Fully automated testing of up to 25 wafers at various temperatures
  • Unique ability to load/unload wafers at any temperature

 

Extended flexibility

  • MPI IceFreeEnvironment™ for simultaneous use of MicroPositioners and probe cards, even at negative temperatures
  • Programmable microscope movements for greater automation and ease of use
  • Optimized cable length to test equipment
  • Reduced stage-to-chuck distance for mmW measurements and active tip testing
  • Compatible with wafers on frame

Ergonomic design and compact footprint

  • Easy loading of wafers or a single DUT from the front
  • Integrated active anti-vibration table
  • Fully integrated test station control system for faster, safer and more convenient operation
  • Safety test management (STM™) with automated dew point control
  • Space-saving thanks to intelligent refrigeration unit layout
MPI TS2000 IFE Probers Auto
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MPI TS2500: Fully automatic spike test system up to 200 mm for accurate, reliable 24/7 RF and high-power production testing

Designed for a wide variety of wafer applications

  • RF measurements up to 67 GHz and 4-port configuration
  • Integration of broadband measurements up to 220 GHz
  • Simultaneous RF, DC-IV / DC-CV / Pulsed-IV measurements
  • High-power applications up to 10 kV/400 A

 

Production reliability

  • Designed for 24/7 production reliability
  • Lockable security doors for a closed environment

 

Ergonomic design and options

  • Designed for easy front loading/unloading of single wafers or 75, 100, 150 and 200 mm cassettes.
  • Two standard cassettes for 100, 150 or 200 mm wafers
  • Large test board supporting up to 4 RF micropositioners or standard 4.5″ / 6.5″ pin card holder
  • Available with various ambient or thermal chucks from 20°C to 300°C
  • Wide range of microscopes
  • Off-axis camera for wafer alignment
  • Optional camera on chuck to align tips with pads
  • Option for handling thin wafers down to 50 μm
MPI TS2500
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MPI TS2500-SE: Fully automatic pin testing system up to 200 mm for accurate and reliable 24/7 production testing at a wide temperature range with ShielDEnvironment™

Designed for a wide variety of wafer applications

  • Simultaneous RF measurement, DC-IV / DC-CV / Pulsed-IV, up to a few fA, μV
  • Testing humidity or other parameters in a controlled test environment
  • Low-noise RF measurements

 

Production reliability

  • Designed for 24/7 production reliability
  • Lockable security doors for a closed environment

 

Ergonomic design and options

  • Designed for easy front loading/unloading of single wafers or 75, 100, 150 and 200 mm cassettes.
  • Integrated MPI ShielDEnvironment™ for advanced light-tightness and EMI shielding
  • Large test board supporting up to 8 DC manipulators or 4 RF + 4DC manipulators or standard 4.5″ / 6.5″ tip card holder
  • Two standard cassettes for 100, 150 or 200 mm wafers
  • Available with various ambient or thermal chucks from -60°C to 300°C
  • Wide range of microscopes
  • Off-axis camera for wafer alignment
  • Optional camera on chuck to align tips with pads
  • Option for handling thin wafers down to 50 μm
MPI TS2500 SE
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MPI TS3500: Fully automatic sub-tip test systems up to 300 mm dedicated to product engineering with IceFreeEnvironment™

Designed for a variety of wafer applications

  • DC-IV / DC-CV / Pulsed-IV applications
  • RF, mmW, load-pull applications and 4-port configuration
  • Validation of integrated circuit design, failure analysis over a wide temperature range from -60 to 300 °C
  • Wafer reliability tests

 

WaferWallet® option

  • Designed with five individual drawers for ergonomic, manual loading of 150, 200 or 300 mm wafers
  • Fully automated testing of up to five wafers at various temperatures
  • Unique ability to load/unload wafers at any temperature

 

Extended flexibility

  • MPI IceFreeEnvironment™ for simultaneous use of manipulators and a tip card, even at sub-zero temperatures
  • Programmable microscope movements for greater automation and ease of use
  • Reduced stage-to-chuck distance for mmW measurements and active tip testing
  • Compatible with wafers on frame

Ergonomic design and compact size

  • Easy loading of wafers or a single DUT from the front
  • Integrated active anti-vibration table
  • Fully integrated test station control system for faster, safer and more convenient operation
  • Safety test management (STM™) with automated dew point control
  • Space-saving thanks to intelligent refrigeration unit layout
  • Instrument rack option for shorter RF cables offering high measurement dynamics
MPI TS3500
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MPI TS3500-HP: Fully automatic under-tip test system up to 300 mm for accurate and reliable high-power measurements

Designed for a variety of wafer applications

  • Device modeling – DC-IV, DC-CV, Pulse-IV, ESD, 1/f
  • RF and mmW – RF configuration from 26 GHz to 110 GHz and beyond
  • Wafer reliability tests – for precise stress and measurement conditions
  • Integrated drivers for leading test software

 

WaferWallet® option

  • Designed with five individual drawers for ergonomic, manual loading of 150, 200 or 300 mm wafers
  • Fully automated testing of up to five wafers at various temperatures
  • Unique ability to load/unload wafers at any temperature

 

MPI ShielDEnvironment for™ precise measurements

  • Advanced EMI / RFI / light shielding for improved 1/f noise test results
  • Very low-noise IV measurements down to fA level
  • Programmable microscope movements for test automation and ease of use
  • Wide temperature range -60 °C to 300 °C with unique configuration flexibility

 

Ergonomic design and options

  • Easy loading of wafers or a single DUT from the front
  • Integrated active anti-vibration table
  • Fully integrated test station control system for faster, safer and more convenient operation
  • Safety test management (STM™) with automated dew point control
  • Space-saving thanks to intelligent refrigeration unit layout
MPI TS3500 HP
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MPI TS3500-SE: Fully automatic sub-tip test system up to 300 mm for accurate and reliable IV, CV, pulsed IV, 1 / f and RF with WaferWallet® option

Designed for a variety of wafer applications

  • Device modeling – DC-IV, DC-CV, Pulse-IV, ESD, 1/f
  • RF and mmW – RF configuration from 26 GHz to 110 GHz and beyond
  • Wafer reliability tests – for precise stress and measurement conditions
  • Integrated drivers for leading test software

 

WaferWallet® option

  • Designed with five individual drawers for ergonomic, manual loading of 150, 200 or 300 mm wafers
  • Fully automated testing of up to five wafers at various temperatures
  • Unique ability to load/unload wafers at any temperature

 

MPI ShielDEnvironment for™ precise measurements

  • Advanced EMI / RFI / light shielding for improved 1/f noise test results
  • Very low-noise IV measurements down to fA level
  • Programmable microscope movements for test automation and ease of use
  • Wide temperature range -60 °C to 300 °C with unique configuration flexibility

 

Ergonomic design and options

  • Easy loading of wafers or a single DUT from the front
  • Integrated active anti-vibration table
  • Fully integrated test station control system for faster, safer and more convenient operation
  • Safety test management (STM™) with automated dew point control
  • Space-saving thanks to intelligent refrigeration unit layout
MPI TS3500 SE
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