distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
The TS3500 is the test station that enables automation at a lower cost using ambient or hot-only thermal chucks. At the same time, there are no limitations on possible options or customer-site upgrades, even up to the fully shielded advanced test station.
The TS3500-IFE and TS3500-SE have features equivalent to MPI’s well-known and established 300 mm TS3000-IFE and TS3000-SE stations, with additional fully automated capability through configuration or upgrade with MPI’s unique WaferWallet® or WaferWallet®MAX.
MPI's solution reduces the overall cost of testing for the customer by providing full automation at a very competitive price compared to semi-automated products from other suppliers.
It incorporates MPI's advanced technologies, such as PHC™ as standard, and mDrive™ and/or VCE™ as an option or as a field upgrade.
IceFreeEnvironment™
Incorporating MPI’s IceFreeEnvironment™, the TS2000-IFE enables testing with MicroPositioners and probe cards simultaneously over a wide temperature range of -60°C to +300°C.
The design shortens the signal path, making the probe station an ideal choice for mmW and/or load-pull applications.
ShielDEnvironment™
MPI ShielDEnvironment™ is a high-performance local environmental chamber that provides an excellent EMI and light-tight shielded test environment for ultra-low noise and low capacitance measurements.
Hot and Cold Wafer Change
Returning the chuck to room temperature is no longer a problem. required during the wafer loading and unloading process. With the WaferWallet®, MPI offers valuable time savings with a unique wafer loading/unloading capability while the chuck remains at any test temperature.
Test Automation
Simple and fast manual alignment of wafers in the tray via a notch sensor makes initial wafer loading fast and reliable. Depending on the operational methodology, other options such as wafer pre-alignment, ID reader or PTPA capability on the TS3500-SE are additional features that increase automation levels.
The WaferWallet®
The common practice for device characterization in the modeling and development processes of new technologies is to extract data from a few typical wafers via highly accurate IV-CV, 1/f, RF, mmW and Load-pull measurements.
MPI’s WaferWallet® extends the automation of the TS3500 Series without compromising measurement capability. The WaferWallet® is designed with five individual trays for manual and ergonomic loading of 150, 200 or 300 mm wafers. Fully automated testing is possible with up to five identical wafers at different temperatures.
WaferWallet®MAX - 10x Higher Productivity
MPI’s WaferWallet® MAX is scalable and meets the demand for faster time to market by collecting data from multiple 100, 150 or 200 mm wafers and increasing testing in a pre-production environment.
With the fastest thermal transition time, reduced soak time, advanced alignment technologies, hot/cold swapping of cassettes or wafers, the WaferWallet® MAX increases system productivity and test cell efficiency by up to 10 times.
The Wafer-ID reader is available as an option.
A wide range of chucks to suit the application
The TS2000-IFE is available with different chuck options to meet different budgets and application requirements:
Ambient chucks: Coaxial, Triaxial or RF with two ceramic auxiliary chucks for precise RF calibration.
Various ERS AirCool thermal chucks from -60°C to 300°C.
Various choices of optics and movements
A wide range of optics is available for all common DC/CV applications or for high magnification digital microscopes for RF or load-pull configurations.
