Wafer cleaner

Semi-automatic Wafer Cleaner – AWC-650

This equipment automatically cleans up to 200 mm (8″) frame-mounted wafers after a dicing or scribing process, with wafer-by-wafer manual loading.

The operator can control the cleaning cycle from the PLC: chuck rotation speed, DI water pressure and nozzle movement, recipes (number and duration of cycles), etc.

At the end of the process, the machine performs a nitrogen sweep drying operation.