distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
Semi-automatic Scriber & Breaker – S100
For ring-mounted wafers up to 100 mm (4″), this equipment enables semi-automatic scribing operations: chuck alignment in XY and θ using the vertical camera, Z axis and scribe. Wafer/substrate loading and unloading is performed manually.
The S100 also incorporates a breaker, enabling automatic cleavage immediately after scribing, or controlled by the operator.
The angle of the diamond and the weight it exerts on the substrate can be adjusted.
The software is very ergonomic and easy to use.
Semi-automatic scribe – S200
For wafers up to 200 mm (8″), this equipment enables semi-automatic scribing operations: chuck alignment in XY and θ using the vertical camera, Z axis and scribe. Wafer/substrate loading and unloading is performed manually.
The cleavage is then carried out manually by the operator.
The angle of the diamond and the weight it exerts on the substrate can be adjusted.
The software is very ergonomic and easy to use.
