Wafer cleaning

Robotechnik's OPTIwet series comprises high-performance wet processing systems designed for cleaning and etching wafers or substrates. These systems are ideal for achieving excellent process results, cleanliness, and repeatability. The OPTIwet series includes models such as the OPTIwet ST30 and ST60, each tailored to specific needs and applications.

The OPTIwet ST30 is designed for wafers up to Ø 12” or substrates up to 9” x 9”. It features an optimized process chamber with a locked chamber door, ensuring excellent process results.¹ The OPTIwet ST60 supports larger wafers up to Ø 600 mm or substrates up to 400 mm x 400 mm, making it suitable for a wider range of applications.

Technical Advantages:

• Uniformity and Repeatability: The optimized process chamber design ensures excellent uniformity and repeatability of cleaning and etching on various wafer sizes.
• Versatility: Capable of handling various processes, including mechanical cleaning, etching, lift-off, and drying.
• Ease of Use: Features such as touchscreens, programmable speed and acceleration, and easy chuck changes enhance the user experience and maintenance.
• Automation: Options for electronic media arms, programmable dispensing systems, and other automated features improve process efficiency and repeatability.

Applications:

These cleaning systems are widely used in the semiconductor industry for processes such as particle removal, etching of various materials (e.g., SiO2, TiW, Cu, Al, Cr), and lift-off. They are essential tools for achieving uniform, high-quality cleaning and etching on various substrates, ensuring optimal performance in subsequent manufacturing steps. They can also be used in many other fields such as optics, aerospace, etc.