Wafer surface particle inspection machine

Designed to meet the stringent requirements of the semiconductor industry, the wafer surface particle inspection machine enables rapid and accurate detection of contaminants on glass or mirror wafers up to 12 inches.

Equipped with a high-resolution linear laser scanning system, it offers a detailed analysis of surface defects such as dust, polishing residues, or post-process particles.

Thanks to its ability to detect particles as small as 0.1 µm and to analyze up to 3000 particles with a statistical tolerance <±5%, this machine integrates perfectly into the quality control protocols of semiconductor substrates, including in cleanroom environments, up to ISO 6 depending on production needs.