Soldering and reflow furnaces

Ovens and ovens for bumping, balling, LED assembly, SMT annealing, preforms and pin-in-paste processes.

• Front or top opening (safety lock to prevent opening during the process)
• Resistive or radiant heating (infrared lamps) up to 650°C
• Temperature uniformity
• Ultra-controlled process in perfectly repeatable conditions for an identical result for each process
• Up to 2 gas lines
• Possibility to inject a flow of formic acid during heat treatment (to avoid voids)
• Vacuum up to 10-3 hPa
• Temperature rise rate: 200°C/min max
• Ultra compact systems
• Programming touch screen
• Wafer up to 200 mm