For bumping, balling, LED assembly, SMT annealing, preforms and pin-in-paste processes
- Front or top opening (safety lock to prevent opening during process)
- Resistive or radiant heating (infrared lamps) up to 650°C
- Temperature uniformity <1°C
- Ultra-controlled process under perfectly repeatable conditions for identical results in every process
- Up to 2 gas lines
- Formic acid can be injected during heat treatment (to avoid voids) Vacuum up to 10-3 hPa
- Temperature rise rate: 200 °C/min max.
- Ultra-compact system
- Touch screen programming
- Wafer up to 200 mm
