Soldering/reflow furnaces (RSO, RSS and VSS)

For bumping, balling, LED assembly, SMT annealing, preforms and pin-in-paste processes

• Front or top opening (safety lock to prevent opening during process)
• Resistive or radiant heating (infrared lamps) up to 650°C
• Temperature uniformity <1°C
• Ultra-controlled process under perfectly repeatable conditions for identical results in every process
• Up to 2 gas lines
• Formic acid can be injected during heat treatment (to avoid voids) Vacuum up to 10-3 hPa
• Temperature rise rate: 200 °C/min max.
• Ultra-compact system
• Touch screen programming
• Wafer up to 200 mm