distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Laser marking/drilling/cutting


  • Double laser head (cutting nozzle and marking nozzle)
  • For Si, SiC, GaN, GaAs, InP, GaP, Al2O3, AlN, glass, CdTe, metal and polymer substrates
  • Substrate up to 150 mm (more on request)
  • Auto loading (possible with cassette) or manual loading
  • CO2 laser source
  • 350-1000 W RF laser generator
  • Custom-made Chuck
  • Motorized Z-focus
  • Camera alignment system (pattern recognition option)
  • Particle and fume filtration system (suction under and behind the chuck)