Laser marking/drilling/cutting

AUREL ALS200

• Double laser head (cutting nozzle and marking nozzle)
• For Si, SiC, GaN, GaAs, InP, GaP, Al2O3, AlN, glass, CdTe, metal and polymer substrates
• Substrate up to 150 mm (more on request)
• Auto loading (possible with cassette) or manual loading
• CO2 laser source
• 350-1000 W RF laser generator
• Custom-made Chuck
• Motorized Z-focus
• Camera alignment system (pattern recognition option)
• Particle and fume filtration system (suction under and behind the chuck)