distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
RF wafer test tips convert electromagnetic energy traveling along coaxial cables to the object under test and its contact pads.
The conversion must be carried out with minimal distortion and energy loss.
There are significant differences between the various types of RF DUTs, from discrete elements to complex integrated circuits operating over a very wide frequency range. RF test tip technology must therefore support a wide range of frequencies and pitches, as well as various tip configurations. Finally, the price of the tips and their lifespan directly influence the cost of testing.
With a critical understanding of the many challenges associated with today's RF applications, MPI Corporation has developed TITAN™ RF Test Tips, a series of products specifically optimized for these complex applications focused on the requirements of advanced RF customers. TITAN™ Test Tips offer the latest technological and manufacturing advancements in RF testing using MPI's patented world-class MEMS technology.
MEMS Tips
Precision-manufactured MPI TITAN™ test tips feature perfectly matched 50 Ω MEMS contact tips. They ensure unsurpassed calibration and measurement results over the widest possible frequency range thanks to the probes' superior electrical characteristics.
Unique contact structure
Unlike any other tips on the market, MPI TITAN™ RF probes offer excellent real-time visibility of tip contacts thanks to the unique protrusion tip design. For the first time, highly accurate positioning of the RF test tip on calibration standards or DUT pads has become possible, even for inexperienced operators and without the use of probe alignment marks.
Quality of Contact
MPI Corporation expands the TITAN RF probe family by introducing the TITAN-RC probe. This new probe model features a reduced contact tip size of 20 μm. Fully aligned with the industry trend of further reducing pad size for RF devices and integrated circuits, the TITAN-RC test tip significantly reduces the cost of testing for next-generation commercial RF devices and mmW silicon devices. It enables accurate and repeatable measurement results for Si devices with Al pad metallization as small as 30 x 35 μm. TITAN-RC probes are available in GSG configuration with a pitch from 50 μm to 300 μm.
Exceptional lifespan
One of the strongest features of TITAN™ technology is its uniform wear: after hundreds of thousands of measurement cycles, the probe tip length naturally shrinks. However, the electrical characteristics remain unchanged due to the unique probe design. Thus, the service life of TITAN™ probes surpasses that of comparable probe technologies. Finally, TITAN™ probes are distinguished by a very competitive price.
Multi-contact test tips
Designing, debugging, and testing modern RF integrated circuits is a task of unprecedented complexity. In addition to RF input and output signals, the device requires oscillation-free biasing as well as digital control signals (e.g., to change the amplifier gain). All of these signals must be transmitted to the integrated circuit via the smallest possible contacts, individually configured for each product. The Multi-Contact Probe extends MPI's TITAN™ RF technology to meet these testing needs. Featuring up to 15 contacts with an RF bandwidth of up to 6 GHz each and a pitch ranging from 50 to 300 μm, this probe is individually configurable to meet your specific needs. It is built using standard, off-the-shelf components and therefore offers the shortest lead time. You can start testing your RF IC in just one week after configuring your TITAN™ Multi-Contact Probe using the online design capture tool.
