distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Atomic Layer Deposition (ALD)

Encapsulix technology: innovative, fast and efficient

  • Extremely uniform gas flow distribution at high speeds thanks to a unique, patent-protected injector design.
  • Fast, precise gas injection
  • Ultra-high-efficiency draining (reduced draining time)
  • Extremely robust design (long service life)
  • No parasitic deposits (no cleaning required)
  • Cycling time is around 30 times faster than standard equipment (up to 100 times faster).

Compact, reliable, optimized equipment:

  • Design flexibility for research and production needs
  • 200 mm or larger substrates (wafers, glass, supports with 3D parts, etc.)
  • Capacitively coupled plasma with uniform electric charge distribution
  • Stand-alone or clustered (MESC), loadlock cassette

Highly configurable equipment :

  • 6 gas
  • 5 metal precursors
  • 4 oxidants (including ozone)
  • In situ metrology (QCM, ellipsometry, emission spectrometry, impedance sensor, etc.)