distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Chip sorters (Automatic Die Sorter)

VEGA, AVIOR, CAPELLA, GEMINI

Parcourir les produits de la gamme

The MPI LED Mapping die Sorter series is a high-speed die sorting solution designed with a modular architecture to meet each customer's specific requirements.

These sorters use advanced Pick & Place technology to achieve cycle times of up to 55ms/chip, with a large sorting area and multiple sorting arms to improve production efficiency and throughput.

The main features are:

  • Versatile handling for chips from 0.15mm to 2mm
  • Up to 200 bin frames with configurable cassette settings
  • Optional Back Side Inspection (BSI) module to detect defects and improve yields
  • Intuitive control software with industry standard SECS/GEM communication protocols
  • Collaborative engineering to provide personalized, turnkey solutions to clients.

These systems are offered in fully automatic and semi-automatic configurations to meet different production needs.

Excellent test accuracy: short separation between object and ISP for optimal light collection and matrix offset compensation,

Thermal Testing: Supports a wide temperature range, including high temperature and subzero testing, with precise temperature control via thermal chuck.

Flexible material handling: Quick change from tabletop to Gelpak® and tape to frame.

Multi-Site Testing: Multiple test stations for near-field, far-field and LIV scanning measurements.

Fast cycle times :

Multiple testing stations enable extremely fast sampling and sorting cycles, reducing the cost of testing. Cycle times vary from 350 to 2700 ms/chip depending on the model.

Force control from 5g to 200g

Manipulation des wafers :

Supports 6-8 inch wafers.

High precision :

Placement accuracy up to ±5 μm with resolution as fine as 0.2 μm in some axes.

Configuration of up to 10 cassettes and therefore 200 frames

And many others :

  • Automatic nozzle cleaning
  • Automatic learning of the sampling level (ejector and nozzle)
  • Semi-automatic nozzle center alignment
  • Semi-automatic nozzle center alignment
  • Automatic prevention of platelet dislocations

Connectez-vous à notre expert
Nicolas Roy
nicolas.roy@microtest-semi.com

Merci d'entrer vos coordonnées pour télécharger la fiche technique.