The MPI LED Mapping die Sorter series is a high-speed die sorting solution designed with a modular architecture to meet each customer's specific requirements.
These sorters use advanced Pick & Place technology to achieve cycle times of up to 55ms/chip, with a large sorting area and multiple sorting arms to improve production efficiency and throughput.
The main features are:
These systems are offered in fully automatic and semi-automatic configurations to meet different production needs.
Excellent test accuracy: short separation between object and ISP for optimal light collection and matrix offset compensation,
Thermal Testing: Supports a wide temperature range, including high temperature and subzero testing, with precise temperature control via thermal chuck.
Flexible material handling: Quick change from tabletop to Gelpak® and tape to frame.
Multi-Site Testing: Multiple test stations for near-field, far-field and LIV scanning measurements.
Fast cycle times :
Multiple testing stations enable extremely fast sampling and sorting cycles, reducing the cost of testing. Cycle times vary from 350 to 2700 ms/chip depending on the model.
Force control from 5g to 200g
Manipulation des wafers :
Supports 6-8 inch wafers.
High precision :
Placement accuracy up to ±5 μm with resolution as fine as 0.2 μm in some axes.
Configuration of up to 10 cassettes and therefore 200 frames
And many others :