Wafer mounting on tape (Wafer Mounter)

The main features of the manual wafer mounter:

• Incredibly durable, this equipment is designed to accompany you for a lifetime.
• The roller and the adjustable pressure plate can handle virtually any material, including thin or brittle substrates.
• The chuck temperature adjustment and the tension adjustment provide optimal application conditions for standard Blue tape and UV tape cutting tapes.
• The excess tape is cut from the frame precisely and safely using a circular cutter.
• Flexible, multiple options allow you to customize the equipment according to your needs: Chuck low contact, chuck no-contact, square frame, ESD, UV protection film ejector, wafer alignment, etc..
• Simple, the system only requires an air supply and electricity to to work.

The wafer installation on frame can also be done semi-automatically up to a size of 8 inches (200mm).

Thanks to the vacuum mounting technology, the application is done without the use of a roller. This equipment therefore ensures minimal contact and mechanical force on the sample, which allows the handling of the thinnest wafers.

The VWM-871 is easy to set up and use, offering precision and reproducibility with minimal operator intervention.
All excess tape is cut and ejected automatically in complete safety.

The fields of application are: production, thin wafers, BGA, CSP, wafers with reliefs, and various industries.