distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Treatment and annealing furnaces (RTP and VPO)

For rapid annealing, oxidation, nitriding, sulfurizing, carburizing, dopant diffusion, crystallization, densification and wafer bonding processes.

  • Auto loading or manual loading on request, single or from 5 or 25-wafer cassettes
  • Front or top opening (safety lock to prevent opening during process)
  • Radiant heating (top and bottom infrared lamps) up to 1200°C
  • Temperature uniformity < 1°C
  • Ultra-controlled process under perfectly repeatable conditions for identical results in every process
  • Up to 4 gas lines
  • Safety enclosure around furnace for hydrogen process
  • Pressure from 3.10-3 hPa to 10-6 hPa
  • Temperature rise rate: 100 °C/s max.
  • Temperature descent rate: 200 °C/min max.
  • Ultra-compact system
  • Touch screen programming
  • Wafer up to 300 mm