MICRO
TEST
French distributor of equipment and consumables for the Semiconductor industry.
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Our equipment
Front-End
Deposition of thin layers
Sputtering/Pulverization (PVD)
Evaporation (PVD)
CVD/PE-CVD
Wafer cleaning
Wafer cleaning
Photo lithographie
Spin coater & spray coater
Hot plates
Clusters
Laser photolithography
LED maskers and mask aligners
Gravure
Plasma etching/Ionic machining
Fours, Ovens
Treatment and annealing furnaces (RTP and VPO)
Ovens, incubators
Assemblage
Assembling you wafer
Wafer mounting on tape (Wafer Mounter)
Cutting
Semi-automatic Scriber & Breaker (S100)
Manual Scriber
Post sawing cleaning
Automatic Wafer Cleaner
Insolation UV
Manual UV curing (lamps or LEDs)
Auto UV curing (UV-9200/UV-9300)
Sorting and Micro-Wiring
Semi-automatic Pick Place (Die Bonder)
Full-Automatic Pick Place (Die Bonder)
Pick Place Manuel (Die Bonder)
Micro ultrasonic wire bonder
Laser systems
Laser Trimer
Laser marking/drilling/cutting
Screen printing
Screen printer
Fours, Ovens
Static and continuous furnaces
Temperature chambers
Soldering/reflow furnaces (RSO, RSS and VSS)
Test
Test under tips/Prober
Micro test chambers/ Microprobe
Micro test chamber for LCC chip
Optical microchamber
Vertical electrochemical Raman reactor
Sample holder for scanning microscope
Temperature Test
Cooling unit (chiller, air-conditioning cooler)
Temperature chambers
Hot plates
Other Tests
Burn-In (Aging test)
Leak Test
HAST test
Optical Test
Chip sorters (Automatic Die Sorter)
Test solutions for photonics (Photonics Automation Probers)
Optical inspection: AOI systems
Consumables and Tools
Packaging
Film frames – Cadres pour wafers
Individual boxes for wafers on frames or rings
Magazines for wafers on frames or rings
Grip Rings (GRP) – Plastic rings for wafers
Manipulation
Wafer grippers
Tweezers
Cutting and folding pliers
Handling when empty
Taken by vacuum – wafers
Vacuum pick-up – components and small parts
Vacuum grip consumables: suction cups
Die bonding – Bonding test
Bonding tools: holders
Picking tools
Bond testing tools
Detached parts
Spare parts
Our services
Installation/formation
SAV
Preventive and corrective maintenance
Calibration, temperature calibration
Equipment rental
Our partners
Front-end equipment
Assembly Equipment
Test Equipment
Consumables
About us
Our team
Our history
Our enterprise
Our partners
Localisation
Environnement
News
English
Sorting et Micro-câblage
Micro ultrasonic wire bonder
Semi-automatic Pick Place (Die Bonder)
Full-Automatic Pick Place (Die Bonder)
Pick Place Manuel (Die Bonder)
