distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
Semi-automatic Pick&Place PP-One
This die-bonder enables automatic chip transfer (chip-to-chip C2C, chip-to-substrate C2S, wafer-to-wafflepack “Sorter”, wafflepack-to-substrate, laser bar stacker/unstacker, etc., depending on configuration), with manual loading/unloading, to an accuracy of <10 µm.
Aiming and alignment accuracy are guaranteed by observation of the process via 2 vertical cameras (image on remote screen), which avoids parallax phenomena.
Automated transfer enables production operations to be carried out in batches of 5,000 or 10,000 parts. Depending on the process, output can reach 1,000 parts/hour.
The PP-One represents an excellent compromise between R&D/prototyping and small/medium production runs.
Options include XY input and/or output motorization (e.g. glue pattern), flip-chip alignment module, heated substrate holder, eutectic module, micrometric table, side inspection camera, etc.
Semi-automatic Pick&Place – PP6 “Universal
With its motorized XY table, like the Z axis, this die-bonder is perfectly designed for R&D applications, thanks to its versatility and very high precision (<5 µm).
In fact, it can be configured for any type of process: eutectic in atmospheric or formic acid gas, for example), flip-chip alignment, glue/epoxy pattern, etc.
Aiming and alignment accuracy are guaranteed by observation of the process via a vertical camera (image on remote screen), which avoids parallax phenomena.
