distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
UV-KUB 1 LED UV Masking System
KLOE has significant experience in photolithography thanks to its DILASE direct laser writing technology, and has introduced the UV-KUB range of equipment for UV exposure of photosensitive materials. The UV-KUB is a simple exposure system based on UV LEDs with 2 sources available at 365 or 405 nm, depending on the version. It is a very compact table top system allowing the exposure of wafers up to 4 inches.
The UV-KUB 1 has a perfectly monochromatic source at 365 or 405 nm, is compatible with all photosensitive resins and offers a resolution of 2 µm.
Système de masquage UV LED UV-KUB 2
KLOE has significant experience in photolithography thanks to its DILASE direct laser writing technology, and has introduced the UV-KUB range of equipment for UV exposure of photosensitive materials. The UV-KUB is a simple exposure system based on UV LEDs with 2 sources available at 365 or 405 nm, depending on the version. It is a very compact table top system allowing the exposure of wafers up to 4 inches.
The UV-KUB 2 has a perfectly monochromatic source at 365 or 405 nm, is compatible with all photosensitive resins and offers a resolution of 2 µm. It is, moreover, compatible with “hard and soft contact” processes, and allows control of the distance between the mask and the substrate.
Système de masquage UV LED UV-KUB 6
KLOE has significant experience in photolithography thanks to its DILASE direct laser writing technology, and has introduced the UV-KUB range of equipment for UV exposure of photosensitive materials. The UV-KUB is a simple exposure system based on UV LEDs with 2 sources available at 365 or 405 nm, depending on the version. It is a very compact table top system allowing the exposure of wafers up to 6 inches.
L’UV-KUB 6 possède une source parfaitement monochromatique à 365 ou 405 nm, est compatible avec toutes les résines photosensibles et offre une résolution de 2 µm. Il est, de plus, compatible avec les procédés à « hard and soft contact », et permet le contrôle de la distance entre le masque et le substrat. Il est compatible avec les wafers jusqu’à 6 pouces.
