distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Semi-automatic Scriber & Breaker (S100)


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Semi-automatic wafer scriber/breaker

The Scriber 100 is a machine designed for cutting delicate chips such as 3 5 components. It is very flexible and allows you to create a chip with mirrored faces (keeps the finished chip clean and free of any marks).
In break mode, the scribe 100 uses the rubber and the knife to create a linear propagation from the small initial marking (from 10µ m).
All settings can be accessed and changed via a touch screen, the machine is robust and vibration-free, and requires minimal training to use. The parts are positioned on a blue film with low adhesion.

GROOVING HEAD

  •  Z movement
  •  Grooving force adjustable from 10g to 80g; constant weight, optional additional weight,
  •  Diamond tool: Adjustable in angle (52 to 65°) and in rotation

TABLE MOTORISEE X Y

  • Chuck for wafers up to 4'',
  • Component size: Minimum 100 μm square
  • Wafer thickness: from 50µm to 500µm
  • 90 degree manual rotation
  • Precise rotation alignment by micrometric screw
  • X Y table / resolution 0.23μm and displacement 1µm
  • Motion control with joystick and/or mouse.

VISION SYSTEM

  • App-compatible optics and magnification
  • 22'' TFT monitors and ultra high definition color camera
  • 10X electronic zoom
  • LED lighting
  • JFP crosshairs software for creation of targets

BREAKER

  • Break mode : operator controlled or automatic
  • Breaking method : Using a rubber and a lower knife

PARAMETERS

  • 7” touch screen
  • Easy adjustment of the focus, by screw.
  • Possibility of regular grooving from the blue film placed on a ring, programmed Z motor.
  • Standard diamond tool, angle adjustment and rotation correction. This allows grooving and breaking of small parts, such as laser bars or laser diodes, to be carried out, the alignment of the rotation of the wafer is carried out using a micrometer.
  • Reference chuck: The parts to be engraved are placed on this reference chuck (with and without blue film).
  • Chuck : « use without blue film »
  • to move large parts, like a wafer, to make quarters, or large strips.
  • this chuck is connected to a motorized X using a pin.
  • can perform local theta alignment of the workpiece, using ''chuck theta alignment without blue film''.

Connectez-vous à notre expert
Pierre Turin
pierre.turin@microtest-semi.com

Merci d'entrer vos coordonnées pour télécharger la fiche technique.