distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.

Wet Process

Wet Process (lift-off, etching, cleaning, drying)

Equipment for developing, etching, cleaning and drying substrates, in manual, semi-automatic or automatic (cluster version) mode, for substrates up to Ø300 mm (12″) or 230 x 230 mm (9″ x 9″), via an ultrasonic (or optional megasonic) nozzle.

For operator safety, the process takes place in a closed chamber, made of PP (polypropylene) like the rest of the equipment.

Dispensing lines can be heated up to 80°C.

Application examples: Piranha (H2SO4 + H2O2 mixture), SC1, SC2, Acid, Base