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Wafer Bonding/Debonding

AFIXX/DEFIXX – Wafer Bonder/Debonder

For substrates up to Ø300 mm (12″) or 230 x 230 mm (9″ x 9″), AFIXX/DEFIXX equipment enables temporary wafer bonding, either manually, semi-automatically or automatically, depending on the range.

Bonding is done without applying pressure, just by vacuum.

All bonders/debonderers feature a 200°C heating plate, and can work with most materials: glass, sapphire, silicon or ceramic.

Available in manual, semi-automatic and automatic versions.