distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
distributeur français d’équipements et consommables pour l’industrie du Semiconducteur.
Wafer-Mounter manual – MWM-850/853
This is a device for manually mounting a wafer up to 200 mm (8″) for the “MWM-850″ and up to 300 mm (12”) for the “MWM-853” on a stainless steel frame.
It’s a reliable, easy-to-use system with high process repeatability, incorporating a vacuum generator (venturi, to hold the wafer on the chuck) and a system for safe lateral and circular cutting of the film thanks to a protective glass.
For thin wafers (thickness < 200 µm), we recommend installing a microporous “thin wafer chuck”.
In the case of wafer-on-frame mounting with UV film, we integrate into the machine a system for removing the protective film from the UV film, as well as an antistatic ionizing bar to discharge static electricity from the film (the film becomes highly charged when the protective film is removed).
Semi-automatic Wafer-Mounter – VWM-871
This equipment automatically mounts wafers up to 200 mm (8″) on stainless steel frames, with manual wafer-by-wafer loading.
Intuitive software, accessed via a touch-screen, enables operator control of film tension (with air-bubble prevention system) and chuck temperature (if required).
The equipment incorporates a vacuum generator, and there is no mechanical contact between the wafer/substrate and any part of the machine.
For wafer-on-frame mounting with UV film, the following options can be integrated: a system for removing the protective film from the UV film, and an antistatic ionizing bar to discharge static electricity from the film.
