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Pick & Place Manual

Manual Placer MPS

This die-bonder enables 100% manual chip transfer (chip-to-chip C2C or chip-to-substrate C2S), and controls glue/resin deposition by syringe or stamping tool via a time-pressure system.

Aiming and alignment accuracy are guaranteed by observation of the operation in progress via a vertical camera (image on remote screen), which avoids parallax phenomena, for optimal transfer into housings and/or in the case of very small pads, for example.

The software associated with this camera is very ergonomic and easy to use.

The MPS is particularly well suited to R&D and prototyping applications, whether in industrial or academic environments.

Possible options: flip-chip alignment module, heated substrate holder, eutectic module, micrometric table, side inspection camera, etc.