High-performance probing of laser diodes, photodetectors, optoelectronics communication devices, LEDs
- Top probing or top/bottom probing
- Wafer probing, package probing or die probing
- Low or high temperature
- Semi-automatic or full automatic
- Optical test (LIV, spectral…), electrical test (low noise, low leakage current…) and LCR test
- Low contact force of tips to prevent scratching
- Single-site or multi-site testing
- High-precision probing
- Automatic loading from 4 x 25-wafer cassettes
- Wafer up to 8