{"id":31647,"date":"2026-06-09T12:52:11","date_gmt":"2026-06-09T12:52:11","guid":{"rendered":"https:\/\/microtest-semi.com\/31647"},"modified":"2026-07-31T10:12:11","modified_gmt":"2026-07-31T10:12:11","slug":"wire-bonding-micro-wiring-a-key-step-in-microelectronics-assembly","status":"publish","type":"post","link":"https:\/\/microtest-semi.com\/en\/31647","title":{"rendered":"Wire bonding (micro-wiring), a key step in microelectronics assembly!"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"31647\" class=\"elementor elementor-31647 elementor-30915\" data-elementor-post-type=\"post\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-0f80b85 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"0f80b85\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-63c8137\" data-id=\"63c8137\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-54d8d12 elementor-widget elementor-widget-text-editor\" data-id=\"54d8d12\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Wire bonding remains one of the most widely used technologies today for creating electrical connections between a chip and its package. Whether for sensors, power components, RF devices, or hybrid circuits, the reliability of this interconnection directly determines the performance and lifespan of the final product. <\/p><p>But behind the generic term \u201cwire bonding\u201d lie two major technologies with very distinct principles:<span style=\"color: #003366;\"> <strong>ball bonding<\/strong><\/span> and <span style=\"color: #ffcc00;\"><strong>wedge bonding<\/strong><\/span>.<\/p><p>Understanding the differences between them is essential to making the right choice, whether in R&#038;D, production, or the laboratory.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6cb75e5 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6cb75e5\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-39b09fc\" data-id=\"39b09fc\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d25e27d elementor-widget elementor-widget-heading\" data-id=\"d25e27d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Ball bonding: the industry standard for gold wires<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-00b0d4e elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"00b0d4e\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-66 elementor-top-column elementor-element elementor-element-794a201\" data-id=\"794a201\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-19cd7c2 elementor-widget elementor-widget-text-editor\" data-id=\"19cd7c2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Ball bonding has historically been the most widely used technology in the semiconductor industry, particularly for the assembly of standard integrated circuits.<\/p><p><span style=\"color: #003366;\"><em>Principle of Operation<\/em><\/span><br\/>The process involves forming a ball at the end of a wire, typically made of gold. This ball is created by an electrical discharge and then pressed onto the pad using force, ultrasonic energy, and a controlled temperature.   <br>The second connection is then made using a stitch bond.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7724e86 elementor-widget__width-initial elementor-widget elementor-widget-image\" data-id=\"7724e86\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"986\" height=\"557\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image3.jpg\" class=\"attachment-large size-large wp-image-30922\" alt=\"Image3\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image3.jpg 986w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image3-300x169.jpg 300w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image3-768x434.jpg 768w\" sizes=\"(max-width: 986px) 100vw, 986px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-top-column elementor-element elementor-element-d04f9a7\" data-id=\"d04f9a7\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-4474e00 elementor-widget elementor-widget-image\" data-id=\"4474e00\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"130\" height=\"378\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image2.png\" class=\"attachment-large size-large wp-image-30920\" alt=\"Image2\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image2.png 130w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image2-103x300.png 103w\" sizes=\"(max-width: 130px) 100vw, 130px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-2ecf979 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"2ecf979\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-b16c7da\" data-id=\"b16c7da\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-cbd085a elementor-widget elementor-widget-text-editor\" data-id=\"cbd085a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"color: #003366;\"><em><strong>Advantages of Ball Bonding<\/strong><\/em><\/span><br\/>\u2022 Very good process repeatability<br\/>\u2022 Excellent compatibility with aluminum pads<br\/>\u2022 High speed, suitable for industrial production rates<br\/>\u2022 Technology fully mastered for Au wires<\/p><p><span style=\"color: #003366;\"><em><strong>Limitations<\/strong><\/em><\/span><br\/>\u2022 Not well suited for aluminum wires<br\/>\u2022 More difficult to access on complex or closely spaced geometries<br\/>\u2022 Less flexible for certain specific applications or prototypes<\/p><p>Ball bonding is therefore particularly well-suited for high-volume applications with standardized geometries and high productivity requirements.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f42c9fe elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"f42c9fe\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7f8d193\" data-id=\"7f8d193\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-435381c elementor-widget elementor-widget-heading\" data-id=\"435381c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Wedge bonding: flexibility and precision, whether with gold or aluminum<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-79de469 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"79de469\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-66 elementor-top-column elementor-element elementor-element-547907a\" data-id=\"547907a\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-69ce29f elementor-widget elementor-widget-text-editor\" data-id=\"69ce29f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Wedge bonding is characterized by a different mechanical approach, but above all by its great versatility.<\/p><p><span style=\"color: #003366;\"><em><strong>Operating Principle<\/strong><\/em><\/span><br\/>There is no ball here. The wire is pressed directly onto the pad and soldered using a wedge-shaped tool. Both connections are made in a similar manner, with very precise control over the wire\u2019s path.  <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-24acf49 elementor-widget elementor-widget-image\" data-id=\"24acf49\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"258\" height=\"171\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image5.png\" class=\"attachment-large size-large wp-image-30929\" alt=\"Image5\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-top-column elementor-element elementor-element-f61e3d1\" data-id=\"f61e3d1\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-cd81198 elementor-widget elementor-widget-image\" data-id=\"cd81198\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"131\" height=\"382\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image4.png\" class=\"attachment-large size-large wp-image-30927\" alt=\"Image4\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image4.png 131w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image4-103x300.png 103w\" sizes=\"(max-width: 131px) 100vw, 131px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-c55f62e elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"c55f62e\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-38b1363\" data-id=\"38b1363\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-696ba8b elementor-widget elementor-widget-text-editor\" data-id=\"696ba8b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p> <span style=\"color: #003366;\"> <em><strong>Advantages of wedge bonding<\/strong><\/em><\/span><br\/>\u2022 Excellent control over wire placement<br\/>\u2022 Ideal for closely spaced pads or complex geometries<br\/>\u2022 Widely used for:<br\/> o sensors<br\/> o power components<br\/> o RF devices<br\/> o R&#038;D and small-volume production<br\/>\u2022 Ability to operate at lower temperatures (particularly with aluminum)<\/p><p><span style=\"color: #003366;\"><em><strong>Limitations<\/strong><\/em><\/span><br\/>\u2022 Slower than ball bonding<br\/>\u2022 Process more dependent on operator skill in manual or semi-automatic modes.<\/p><p>Wedge bonding is often the preferred method when flexibility, precision, and adaptability take precedence over sheer speed.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-4983d43 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"4983d43\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-1e636ea\" data-id=\"1e636ea\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5d29ffc elementor-widget elementor-widget-heading\" data-id=\"5d29ffc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Ball bonding or wedge bonding: How do you choose?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-b50fd48 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"b50fd48\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-d1ebb6e\" data-id=\"d1ebb6e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d18d9b9 elementor-widget elementor-widget-text-editor\" data-id=\"d18d9b9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The choice rarely depends on a single criterion. It is based on a balance between material, application, and process constraints: <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6d2452d elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6d2452d\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-0857a28\" data-id=\"0857a28\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a82b012 elementor-widget elementor-widget-image\" data-id=\"a82b012\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"604\" height=\"264\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/tableau.png\" class=\"attachment-large size-large wp-image-30931\" alt=\"Tableau\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/tableau.png 604w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/tableau-300x131.png 300w\" sizes=\"(max-width: 604px) 100vw, 604px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-0206fbe elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"0206fbe\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-afb95b8\" data-id=\"afb95b8\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-2a4f675 elementor-widget elementor-widget-text-editor\" data-id=\"2a4f675\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>In many laboratories and pilot lines, wedge bonding has emerged as the most versatile solution, particularly when it is necessary to switch quickly from one type of component to another.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-e121063 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"e121063\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-5616933\" data-id=\"5616933\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-dba2960 elementor-widget elementor-widget-heading\" data-id=\"dba2960\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Semi-automatic wire bonding: the right balance<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-ef919b2 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"ef919b2\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7d63baa\" data-id=\"7d63baa\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-8a7bf8f elementor-widget elementor-widget-text-editor\" data-id=\"8a7bf8f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Between fully manual machines and fully automatic production equipment, semi-automatic wire bonders occupy a strategic position.<\/p><p>They offer:<\/p><ul><li>high repeatability<\/li><li>a quick start<\/li><li>great flexibility for R&#038;D, process testing, and small-batch production.<\/li><\/ul><p>It is precisely in this context that the <a href=\"https:\/\/microtest-semi.com\/en\/detail_produit\/micro-ultrasonic-wire-bonder\" target=\"_blank\" rel=\"noopener\">JFP line of semi-automatic wire bonding machines\u2014and in particular the WB200\u2014fits in .<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-76bc561 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"76bc561\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-03e6cee\" data-id=\"03e6cee\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-6c8ae7b elementor-widget elementor-widget-heading\" data-id=\"6c8ae7b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">WB200: Precision, Visibility, and Control in Bonding<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-9edd87e elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"9edd87e\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-27ccd43\" data-id=\"27ccd43\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-b16f5c2 elementor-widget elementor-widget-text-editor\" data-id=\"b16f5c2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/microtest-semi.com\/en\/detail_produit\/micro-ultrasonic-wire-bonder\" target=\"_blank\" rel=\"noopener\">The WB200<\/a> was designed to meet the demands of modern wire bonding, whether using aluminum or gold wire, in ball or wedge configurations.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-e131e71 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"e131e71\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-6ebdae8\" data-id=\"6ebdae8\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d215d48 elementor-widget elementor-widget-image\" data-id=\"d215d48\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"450\" height=\"450\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-450x450.png\" class=\"attachment-techno-team size-techno-team wp-image-30936\" alt=\"Image7\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-450x450.png 450w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-150x150.png 150w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-106x106.png 106w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-560x560.png 560w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image7-80x80.png 80w\" sizes=\"(max-width: 450px) 100vw, 450px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7d51943 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"7d51943\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-98ec57f\" data-id=\"98ec57f\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5a45896 elementor-widget elementor-widget-image\" data-id=\"5a45896\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-image-30943\" alt=\"Image8\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-150x150.png 150w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-300x300.png 300w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-768x768.png 768w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-450x450.png 450w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-106x106.png 106w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-560x560.png 560w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8-80x80.png 80w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image8.png 784w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4f7276a\" data-id=\"4f7276a\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d9235c5 elementor-widget elementor-widget-image\" data-id=\"d9235c5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-image-30945\" alt=\"Image9\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-150x150.png 150w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-300x300.png 300w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-768x768.png 768w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-450x450.png 450w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-106x106.png 106w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-560x560.png 560w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9-80x80.png 80w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image9.png 784w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-0fa3324 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"0fa3324\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-39dedc3\" data-id=\"39dedc3\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-66ce8d8 elementor-widget elementor-widget-text-editor\" data-id=\"66ce8d8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"color: #003366;\"><em><strong>Key features:<\/strong><\/em><\/span><br\/>\u2022 Vertical camera providing direct and precise visibility of the bonding point<br\/>\u2022 Stable and repeatable positioning<br\/>\u2022 Ergonomic design for operator comfort<br\/>\u2022 Perfectly suited for the following environments:<br\/> o R&#038;D<br\/> o laboratories<br\/> o pilot lines<br\/> o small- to medium-volume production<\/p><p><span style=\"color: #003366;\"><strong>The vertical camera offers a decisive advantage<\/strong><\/span> : it allows for precise control of the landing, even on very small or closely spaced pads, and ensures the quality of every connection regardless of the user.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-02511cd elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"02511cd\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-059b1e5\" data-id=\"059b1e5\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5241fdc elementor-widget elementor-widget-image\" data-id=\"5241fdc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"420\" height=\"744\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image10.png\" class=\"attachment-large size-large wp-image-30938\" alt=\"Image10\" srcset=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image10.png 420w, https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image10-169x300.png 169w\" sizes=\"(max-width: 420px) 100vw, 420px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-5be2142 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"5be2142\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-94027d0\" data-id=\"94027d0\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5ac9a5d elementor-widget elementor-widget-heading\" data-id=\"5ac9a5d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Mastering wire bonding ensures the reliability of the component<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-3b5f8d2 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"3b5f8d2\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-5789b4f\" data-id=\"5789b4f\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-54ea581 elementor-widget elementor-widget-text-editor\" data-id=\"54ea581\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Wire bonding is never just a simple assembly step.<\/p><p>It is a critical interface between the chip and its environment, where every parameter (material, geometry, energy, visibility) matters.<\/p><p>Understanding the differences between ball bonding and wedge bonding, and having access to suitable, scalable equipment such as the JFP WB200, enhances reliability, flexibility, and efficiency\u2014from the earliest stages of development through to mass production.<\/p><p><a href=\"https:\/\/microtest-semi.com\/en\" target=\"_blank\" rel=\"noopener\">Microtest<\/a> supports its customers in selecting, integrating, and implementing wire bonding solutions tailored to their applications, transforming a technological constraint into a genuine process advantage.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f6ed62d elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"f6ed62d\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7fb6a96\" data-id=\"7fb6a96\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-e42c0d3 elementor-widget elementor-widget-image\" data-id=\"e42c0d3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t<figure class=\"wp-caption\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/microtest-semi.com\/en\" target=\"_blank\">\n\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"178\" height=\"144\" src=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2025\/11\/Image6.png\" class=\"attachment-medium size-medium wp-image-29298\" alt=\"Image6\" \/>\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<figcaption class=\"widget-image-caption wp-caption-text\">www.microtest-semi.com<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Wire bonding remains one of the most widely used technologies today for creating electrical connections between a chip and its package. Whether for sensors, power components, RF devices, or hybrid circuits, the reliability of this interconnection directly determines the performance and lifespan of the final product. But behind the generic term \u201cwire bonding\u201d lie two [&hellip;]<\/p>\n","protected":false},"author":9,"featured_media":30917,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[291,290],"tags":[293,294,292,295],"class_list":["post-31647","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-packaging","category-wire-bonding","tag-die-bonding","tag-micro-wiring","tag-wedge-bonding","tag-wire-bonding"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Wire Bonding: Microelectronic Wire Bonding | Microtest<\/title>\n<meta name=\"description\" content=\"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/microtest-semi.com\/en\/31647\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Wire Bonding: Microelectronic Wire Bonding | Microtest\" \/>\n<meta property=\"og:description\" content=\"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/microtest-semi.com\/en\/31647\" \/>\n<meta property=\"og:site_name\" content=\"Microtest\" \/>\n<meta property=\"article:published_time\" content=\"2026-06-09T12:52:11+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-07-31T10:12:11+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"795\" \/>\n\t<meta property=\"og:image:height\" content=\"302\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Sylvie OLIVIER\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Sylvie OLIVIER\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647\"},\"author\":{\"name\":\"Sylvie OLIVIER\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#\\\/schema\\\/person\\\/06cdf210e79133ab8a8996f486a9fe46\"},\"headline\":\"Wire bonding (micro-wiring), a key step in microelectronics assembly!\",\"datePublished\":\"2026-06-09T12:52:11+00:00\",\"dateModified\":\"2026-07-31T10:12:11+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647\"},\"wordCount\":709,\"publisher\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Image-avant.jpg\",\"keywords\":[\"die-bonding\",\"micro-wiring\",\"wedge bonding\",\"wire bonding\"],\"articleSection\":[\"packaging\",\"Wire bonding\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647\",\"url\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647\",\"name\":\"Wire Bonding: Microelectronic Wire Bonding | Microtest\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Image-avant.jpg\",\"datePublished\":\"2026-06-09T12:52:11+00:00\",\"dateModified\":\"2026-07-31T10:12:11+00:00\",\"description\":\"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#primaryimage\",\"url\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Image-avant.jpg\",\"contentUrl\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Image-avant.jpg\",\"width\":795,\"height\":302,\"caption\":\"Avant\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en\\\/31647#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Accueil\",\"item\":\"https:\\\/\\\/microtest-semi.com\\\/en\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Wire bonding (micro-wiring), a key step in microelectronics assembly!\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#website\",\"url\":\"https:\\\/\\\/microtest-semi.com\\\/en\",\"name\":\"Microtest\",\"description\":\"French distributor of equipment and consumables for the Semiconductor industry\",\"publisher\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/microtest-semi.com\\\/en?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#organization\",\"name\":\"Microtest\",\"url\":\"https:\\\/\\\/microtest-semi.com\\\/en\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2022\\\/03\\\/logo-microtest.png\",\"contentUrl\":\"https:\\\/\\\/microtest-semi.com\\\/wp-content\\\/uploads\\\/2022\\\/03\\\/logo-microtest.png\",\"width\":343,\"height\":289,\"caption\":\"Microtest\"},\"image\":{\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/www.linkedin.com\\\/company\\\/microtest-semi\\\/\"]},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/microtest-semi.com\\\/en#\\\/schema\\\/person\\\/06cdf210e79133ab8a8996f486a9fe46\",\"name\":\"Sylvie OLIVIER\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g\",\"caption\":\"Sylvie OLIVIER\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Wire Bonding: Microelectronic Wire Bonding | Microtest","description":"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/microtest-semi.com\/en\/31647","og_locale":"en_US","og_type":"article","og_title":"Wire Bonding: Microelectronic Wire Bonding | Microtest","og_description":"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.","og_url":"https:\/\/microtest-semi.com\/en\/31647","og_site_name":"Microtest","article_published_time":"2026-06-09T12:52:11+00:00","article_modified_time":"2026-07-31T10:12:11+00:00","og_image":[{"width":795,"height":302,"url":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg","type":"image\/jpeg"}],"author":"Sylvie OLIVIER","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Sylvie OLIVIER","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/microtest-semi.com\/en\/31647#article","isPartOf":{"@id":"https:\/\/microtest-semi.com\/en\/31647"},"author":{"name":"Sylvie OLIVIER","@id":"https:\/\/microtest-semi.com\/en#\/schema\/person\/06cdf210e79133ab8a8996f486a9fe46"},"headline":"Wire bonding (micro-wiring), a key step in microelectronics assembly!","datePublished":"2026-06-09T12:52:11+00:00","dateModified":"2026-07-31T10:12:11+00:00","mainEntityOfPage":{"@id":"https:\/\/microtest-semi.com\/en\/31647"},"wordCount":709,"publisher":{"@id":"https:\/\/microtest-semi.com\/en#organization"},"image":{"@id":"https:\/\/microtest-semi.com\/en\/31647#primaryimage"},"thumbnailUrl":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg","keywords":["die-bonding","micro-wiring","wedge bonding","wire bonding"],"articleSection":["packaging","Wire bonding"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/microtest-semi.com\/en\/31647","url":"https:\/\/microtest-semi.com\/en\/31647","name":"Wire Bonding: Microelectronic Wire Bonding | Microtest","isPartOf":{"@id":"https:\/\/microtest-semi.com\/en#website"},"primaryImageOfPage":{"@id":"https:\/\/microtest-semi.com\/en\/31647#primaryimage"},"image":{"@id":"https:\/\/microtest-semi.com\/en\/31647#primaryimage"},"thumbnailUrl":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg","datePublished":"2026-06-09T12:52:11+00:00","dateModified":"2026-07-31T10:12:11+00:00","description":"Wire bonding (micro-wiring): principles, ultrasonic technologies, and the key role of this step in microelectronic assembly.","breadcrumb":{"@id":"https:\/\/microtest-semi.com\/en\/31647#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/microtest-semi.com\/en\/31647"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/microtest-semi.com\/en\/31647#primaryimage","url":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg","contentUrl":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2026\/06\/Image-avant.jpg","width":795,"height":302,"caption":"Avant"},{"@type":"BreadcrumbList","@id":"https:\/\/microtest-semi.com\/en\/31647#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Accueil","item":"https:\/\/microtest-semi.com\/en"},{"@type":"ListItem","position":2,"name":"Wire bonding (micro-wiring), a key step in microelectronics assembly!"}]},{"@type":"WebSite","@id":"https:\/\/microtest-semi.com\/en#website","url":"https:\/\/microtest-semi.com\/en","name":"Microtest","description":"French distributor of equipment and consumables for the Semiconductor industry","publisher":{"@id":"https:\/\/microtest-semi.com\/en#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/microtest-semi.com\/en?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/microtest-semi.com\/en#organization","name":"Microtest","url":"https:\/\/microtest-semi.com\/en","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/microtest-semi.com\/en#\/schema\/logo\/image\/","url":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2022\/03\/logo-microtest.png","contentUrl":"https:\/\/microtest-semi.com\/wp-content\/uploads\/2022\/03\/logo-microtest.png","width":343,"height":289,"caption":"Microtest"},"image":{"@id":"https:\/\/microtest-semi.com\/en#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.linkedin.com\/company\/microtest-semi\/"]},{"@type":"Person","@id":"https:\/\/microtest-semi.com\/en#\/schema\/person\/06cdf210e79133ab8a8996f486a9fe46","name":"Sylvie OLIVIER","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/45a6b406475ff772f5e418bb826f57c8b5365e22231a7cced3a4970e0a704fd1?s=96&d=mm&r=g","caption":"Sylvie OLIVIER"}}]}},"_links":{"self":[{"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/posts\/31647","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/comments?post=31647"}],"version-history":[{"count":1,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/posts\/31647\/revisions"}],"predecessor-version":[{"id":31648,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/posts\/31647\/revisions\/31648"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/media\/30917"}],"wp:attachment":[{"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/media?parent=31647"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/categories?post=31647"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/microtest-semi.com\/en\/wp-json\/wp\/v2\/tags?post=31647"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}